Cooling Head Fin Structure to Eliminate TIM Air Gaps

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Solution Overview

Problem

Existing semiconductor testing handlers face inefficiencies in temperature control due to air gaps forming at the interface between the fin structure and thermal interface material, leading to mechanical defects such as warpage and cracking during high-performance computing tests.

Innovation Solution

The implementation of a fin structure with recesses and protrusions that reduce the likelihood of air gaps by increasing contact area and thermal conductivity, enhancing temperature control accuracy and preventing mechanical defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a fin structure is used for temperature control in semiconductor testing, then temperature control capability is improved, but air gaps form at the interface with thermal interface material causing mechanical defects

Engineering Contradiction:

Improvetemperature control capabilityVSAvoidmechanical defect prevention

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The fin structure is pre-formed with recesses at its base before assembly. These recesses are designed to receive and conform to protrusions on the thermal interface material, ensuring that the thermal interface material fully fills the recesses and eliminates air gaps before the assembly undergoes temperature cycling during semiconductor testing.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The fin structure incorporates localized recesses at specific locations where air gaps are most likely to form at the interface with the thermal interface material. This localized modification concentrates the air gap elimination effort where it is most needed, improving thermal contact quality without requiring a complete redesign of the entire fin structure.

Inventive Principle:

Principle #3Local quality

2Temperature

If thermal interface material is applied to fill gaps, then thermal contact is improved, but application complexity and potential for defects increase

Engineering Contradiction:

Improvethermal contact qualityVSAvoidapplication complexity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The recesses in the fin structure are designed with specific dimensional parameters (depth, width, shape) that are optimized to match the properties of the thermal interface material. The recesses are sized to ensure complete filling by the thermal interface material while maintaining ease of assembly and reducing the risk of application defects.

Inventive Principle:

Principle #35Parameter changes

3Manufacturing precision

If air gaps are present at the interface, then manufacturing is simpler, but temperature control accuracy deteriorates leading to mechanical defects

Engineering Contradiction:

Improvetemperature control accuracyVSAvoidfin structure complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The base of the fin structure is segmented into multiple recesses rather than being a flat surface. This segmentation creates multiple localized zones for thermal interface material placement, ensuring complete contact between the fin structure and the semiconductor device across the entire interface area, thereby improving temperature control accuracy.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improved temperature control efficiency reduces the risk of mechanical defects in semiconductor devices, ensuring precise and accurate testing results while minimizing costs.

Implementation Method 1

a coolant chamber configured to receive coolant and flow the coolant through the coolant chamber to cool the fin structure

Methodology Applied

Scientific EffectHeat transfer: Convection

Implementation Method 2

a first thermal interface material between the coolant chamber and the fin structure; a second thermal interface material between the heater pad and the fin structure

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

a heater pad coupled to the first thermal interface material

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS20250377406A1Handler with cooling head and double-sided fin structure

Publication Date: 2025.12.11 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A final test (FT) handler including a fin structure. The fin structure includes a first side and a second side opposite to the first side. A plurality of protrusions of the fin structure are at the first side and are defined or delimited by a plurality of recesses that extend into the first side of the fin structures. The plurality of protrusions are inserted into a TIM layer of the FT handler and the plurality of recesses are filled by the TIM layer. The plurality of protrusion and plurality of recesses increase a contact area between the TIM layer and the fin structure. The FT handler is configured to, in operation, pick up, hold onto, and transport one or more semiconductor devices to be tested, for example, with a high-performance computing (HPC) test for quality assurance and control purposes.