Cooling Insert With Electrical Barrier for DMD Thermal Management

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Solution Overview

Problem

Digital Micro-Mirror Devices (DMD) chips in print systems overheat due to laser energy, limiting operating power and duty cycle, and existing cooling methods risk condensation and chip failure.

Innovation Solution

A cooling system with a conductive cooling block, thermally conductive grease, and an electrical barrier in the base to efficiently transfer heat away from the DMD chip while preventing electrical grounding, using a coolant circulation system to manage heat without lowering coolant temperature.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If additional cooling is applied by lowering coolant temperature, then chip temperature is reduced, but condensation occurs on the DMD chip causing chip failure

Engineering Contradiction:

Improvechip temperatureVSAvoidchip reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

An electrical barrier layer is introduced as an intermediary between the coolant and the DMD chip. This barrier prevents direct electrical contact that would cause grounding issues while still allowing thermal energy to transfer from the chip through the barrier to the coolant, thus cooling the chip without causing condensation-related failures

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The cooling block is segmented into distinct functional zones: a first region in direct contact with the DMD chip for heat absorption, a second region containing the electrical barrier layer, and a third region for coolant circulation. This segmentation allows independent optimization of thermal contact and electrical isolation functions

Inventive Principle:

Principle #1Segmentation

2Productivity

If DMD chip operates at higher power, then printing productivity increases, but chip temperature exceeds critical threshold causing damage

Engineering Contradiction:

Improveprinting productivityVSAvoidchip temperature

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The cooling block is pre-positioned in thermal contact with the DMD chip before operation begins. The cooling system is pre-configured with the electrical barrier layer in place, allowing the chip to immediately operate at full power without delay for thermal management setup, thus maximizing productivity from startup

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The cooling system operates continuously throughout the printing process, maintaining constant thermal contact between the cooling block and the DMD chip. The coolant circulates continuously through the cooling block, ensuring uninterrupted heat removal that enables sustained operation at 100% power and duty cycle

Inventive Principle:

Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables operation at 100% power and duty cycle without chip overheating or condensation issues, enhancing thermal control and preventing electrical interference.

Implementation Method 1

a cooling block configured to be in conductive communication with a heat source... a cooling fluid is configured to circulate through the base of the cooling block

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10279610B2Cooling insert

Publication Date: 2019.05.07 GENESEE VALLEY INNOVATIONS LLC

AI summary

A temperature control system, the system comprising a cooling block configured to be in conductive communication with a heat source, said cooling block comprising a stem and a base, a cooling fluid configured to circulate through the base of the cooling block, and an electrical barrier formed in the base of the cooling block between the heat source and the cooling fluid.