Cooling System With Insert Elements For Electronic Units
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional liquid-cooled cooling systems are unsuitable for modern electronic components with high energy consumption due to complex designs and long assembly/maintenance times, and they struggle with heat transfer efficiency and compactness.
Innovation Solution
The cooling system features indentations in the cooler wall with insert elements having inner and outer longitudinal channels, where the inclined entry surfaces of the insert elements are offset, allowing for efficient coolant distribution and heat transfer with a simpler design, reducing assembly time and increasing mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional liquid-cooled cooling systems are used for high-power electronic components, then heat transfer efficiency can be maintained, but the design becomes complex and assembly/maintenance time increases
Solution Approach 1:
The cooling system is segmented into modular cooling channels with standardized insert elements that can be independently manufactured and assembled. Each cooling channel contains discrete insert elements with specific flow distribution functions, allowing the system to be built from standardized components rather than custom-machined monolithic structures.
Solution Approach 2:
The patent changes the geometric parameters of the cooling channels and insert elements to optimize flow distribution. By varying channel cross-sections, lengths, and insert element dimensions, the system achieves efficient heat transfer with simpler overall design. The inclined entry surfaces with specific angles and offset positions are parameter optimizations that improve coolant distribution without adding complexity.
2Temperature
If conventional liquid-cooled cooling systems are used for high-power electronic components, then heat transfer efficiency can be maintained, but assembly and maintenance time becomes unacceptably long
Solution Approach 1:
The cooling system is divided into modular sections with standardized insert elements that can be pre-assembled and quickly installed. The insert elements are designed as separate components that fit into standardized cooling channels, enabling rapid assembly without complex machining or custom fitting operations.
Solution Approach 2:
The insert elements are designed with universal applicability across different cooling channel configurations. The standardized geometry and interface design allow the same insert element type to be used in multiple positions and applications, reducing the variety of unique parts that need to be managed during assembly and maintenance.
3Length of stationary object
If compact cooling design is implemented, then construction height is reduced, but heat transfer effectiveness may be compromised
Solution Approach 1:
The patent optimizes the three-dimensional configuration of cooling channels and insert elements to achieve efficient heat transfer in a compact volume. By carefully designing the spatial arrangement, channel orientations, and insert element positions, the system maximizes heat transfer surface area and coolant-flow interaction within reduced construction height.
Solution Approach 2:
The geometric parameters of cooling channels and insert elements are optimized to achieve compact dimensions without sacrificing heat transfer effectiveness. Specific parameter choices for channel cross-sections, lengths, and insert element dimensions enable efficient cooling within reduced space constraints.
4Ease of manufacture
If simpler cooling design is used, then manufacturing efficiency improves, but mechanical stability may be reduced
Solution Approach 1:
The cooling system uses segmented modular components with standardized interfaces that simplify manufacturing while maintaining structural integrity. The insert elements and cooling channels are designed as separate but interlocking components, allowing each to be manufactured independently with standard processes while achieving stable assembled structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves better heat propagation with a smaller construction height, higher mechanical stability, and efficient heat transfer, allowing for effective cooling of high-power electronic components with reduced pressure drop and improved manufacturing efficiency.
Implementation Method 1
the electronic structural unit resting over a large area against a heat-conducting cooler wall (7) of the housing
Implementation Method 2
That end of the insert element which engages the cooling channel is provided with an inclined entry surface and an inlet opening to the inner longitudinal channel
Data Source
Figure 1
Figure 2~4
Figure 5~7
AI summary
The invention relates to a cooling system (1), in particular for cooling an electronic structural unit (2) or assembly, which cooling system is provided with a housing (3) and, therein, with a cooling channel (6) for a coolant. The electronic structural unit (2) rests over a large area against a heat-conducting cooler wall (7) of the housing (3). An apparatus (11) for guiding the coolant onto the cooler wall is provided in the cooling channel (6). The coolant-guiding apparatus (11) has indentations (12) in the cooler wall (7) which are formed transversely to the cooling channel (6) and are open from the cooling channel. An insert element (13) having an inner longitudinal channel (14) for the coolant is inserted into each indentation (12), an outer longitudinal channel (15) which is connected to the inner longitudinal channel (14) being formed between the indentation (12) and the associated insert element (13). That end of the insert element (13) which engages the cooling channel (6) is provided with an inclined entry surface (19) and an inlet opening (20) to the inner longitudinal channel (14).