Cooling Jacket With Light Window for Semiconductor Inspection Heat Removal
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Solution Overview
Problem
Existing cooling units for semiconductor devices with high power consumption require improved cooling performance to effectively manage heat during inspection processes.
Innovation Solution
A cooling unit with a jacket that includes a light passing portion and a space between the jacket and the semiconductor device, where a fluid is supplied through a supply flow path to efficiently transfer heat away from the semiconductor device, and the jacket may also have a discharge flow path and a coolant flow path for enhanced cooling, with the space defining surface extending to surround the light passing portion and having a thickness of 0.05 mm to 0.5 mm for optimal heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling unit ejects cooling liquid to the semiconductor device, then cooling function is provided, but cooling performance is insufficient for high power consumption devices
Solution Approach 1:
The patent introduces a cooling liquid supply chamber as an intermediary space between the cooling liquid source and the semiconductor device. The cooling liquid flows through this chamber and directly contacts the device, creating an efficient heat transfer pathway that significantly improves cooling performance for high power consumption devices.
Solution Approach 2:
The patent utilizes hydraulic flow of cooling liquid through the supply chamber to achieve efficient heat removal. The liquid circulation system creates controlled fluid dynamics that enhance heat transfer from the semiconductor device, addressing the cooling insufficiency of conventional methods.
2Temperature
If cooling liquid is supplied to cool the semiconductor device, then heat is removed, but inspection precision may be affected by liquid interference
Solution Approach 1:
The patent divides the cooling system into distinct functional zones: a supply chamber for liquid introduction, a flow path for heat transfer, and an inspection region. This segmentation allows cooling liquid to be confined to specific areas, enabling effective heat removal while preventing liquid interference with optical inspection processes.
Solution Approach 2:
The cooling liquid is supplied locally to the semiconductor device through the supply chamber, concentrating cooling action where heat generation occurs. This localized cooling approach maximizes heat removal efficiency at the device level while minimizing the presence of cooling liquid in the broader inspection environment, thereby preserving inspection precision.
3Temperature
If a jacket is provided to dissipate heat, then cooling function is achieved, but device complexity increases
Solution Approach 1:
The jacket structure serves multiple functions simultaneously: it acts as a thermal management component for heat dissipation, provides structural support for the semiconductor device, and defines the cooling liquid flow path. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity while achieving effective cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described cooling unit achieves high cooling performance by efficiently transferring heat from the semiconductor device to the jacket via the fluid, effectively cooling the device and maintaining close contact with the stage, even when the semiconductor device is warped, thus ensuring reliable inspection results.
Implementation Method 1
Flowing a fluid to the space defined between the jacket and the semiconductor device can effectively cool the semiconductor device. This is because the heat of the semiconductor device is removed by the fluid
Implementation Method 2
the heat of the semiconductor device is efficiently transferred to the jacket via the fluid
Implementation Method 3
the jacket can be more suitably cooled by flowing a coolant through the coolant flow path
Data Source
AI summary
Provided is a cooling unit to be used in an inspection of a semiconductor device. The cooling unit includes a jacket for dissipating heat of the semiconductor device. The jacket is provided with a light passing portion for passing light from the semiconductor device. The jacket has a space defining surface that faces the semiconductor device and defines a space between the space defining surface and the semiconductor device in a state where the light passing portion faces the semiconductor device. The jacket is provided with a supply flow path through which a fluid to be supplied to the space flows.