Blockchain Server Cooling Liquid Temperature Determination

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Solution Overview

Problem

Conventional methods for determining the temperature of a cooling liquid in liquid-cooling heat dissipation systems for blockchain servers require additional temperature sensors, increasing structural complexity and cost.

Innovation Solution

A method and apparatus that determine the temperature of a cooling liquid by calculating the thermal resistance coefficient of the liquid cooling system using the average temperature and power of the chips, eliminating the need for additional temperature sensors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a temperature sensor is additionally arranged in the liquid cooling plate, then the temperature of the cooling liquid can be directly measured, but structural complexity and cost are increased

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidliquid cooling plate structural complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent uses the chips as an intermediary element to indirectly measure the cooling liquid temperature. Instead of placing a temperature sensor directly in the cooling liquid channel, the system measures the temperature of the chips that are in thermal contact with the cooling liquid, and infers the cooling liquid temperature from the chip temperature and thermal resistance characteristics. This intermediary approach allows temperature measurement without modifying the liquid cooling plate structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The chips serve a dual function: they are both the computational components of the blockchain server and the temperature sensing elements. The chips' own temperature measurements, combined with known thermal resistance values, enable the system to self-determine the cooling liquid temperature without requiring separate dedicated temperature sensors in the cooling plate.

Inventive Principle:
Principle #25Self-service

2Measurement precision

If a temperature sensor is additionally arranged in the liquid cooling plate, then the temperature of the cooling liquid can be directly measured, but cost is increased

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidmanufacturing cost
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The patent makes the chips multi-functional by utilizing them both for computation and for temperature sensing purposes. The same chip that performs blockchain computational tasks also serves as the temperature detection element, eliminating the need for additional dedicated temperature sensors and reducing overall system cost.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The system uses the chips' inherent temperature sensing capability (without additional sensors) to determine cooling liquid temperature, making the existing components serve multiple purposes and avoiding additional manufacturing costs for separate temperature measurement devices.

Inventive Principle:
Principle #25Self-service

3Reliability

If the cooling liquid channel is closed, then the cooling liquid is contained and can effectively cool the chips, but the temperature of the cooling liquid cannot be directly read

Engineering Contradiction:
Improvecooling effectivenessVSAvoidtemperature measurement accessibility
Core Design Contradiction:
ReliabilityVSDifficulty of detecting and measuring

Solution Approach 1:

The patent introduces the chips as an intermediary measurement interface. Since the chips are in direct thermal contact with the closed cooling liquid channel and their temperature can be measured, they serve as a mediator to indirectly access the cooling liquid temperature without requiring direct access to the sealed cooling liquid channel.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces the direct mechanical/physical access approach (opening the cooling channel to insert a sensor) with a thermal field approach. By measuring temperature through the thermal conduction path from the cooling liquid to the chips, the system avoids the need for mechanical access to the sealed cooling channel.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces structural complexity and costs while accurately determining the cooling liquid temperature, ensuring safe operations of the blockchain server.

Implementation Method 1

the plurality of chips and the liquid cooling plate are in exchange of heat

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250077377A1Method, apparatus, blockchain server and storage medium for determining temperature of cooling liquid
Publication Date: 2025.03.06 SHENZHEN MICROBT ELECTRONICS TECH CO LTD
  • US20250077377A1 patent drawing
  • US20250077377A1 patent drawing
  • US20250077377A1 patent drawing

AI summary

A method, an apparatus, a blockchain server and a storage medium for determining a temperature of a cooling liquid are provided. The method includes: determining a first average temperature of a plurality of chips and a first average power of the plurality of chips in a blockchain server, in which the blockchain server includes a liquid cooling system, the liquid cooling system includes a liquid cooling plate and the plurality of chips, the plurality of chips and the liquid cooling plate are in exchange of heat, and the cooling liquid is contained in the liquid cooling plate; determining a thermal resistance coefficient of the liquid cooling system; and determining a first temperature of the cooling liquid based on the first average temperature, the first average power and the thermal resistance coefficient.