Cooling Manifold Bypass for Pump Maintenance

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Solution Overview

Problem

Conventional liquid air assisted cooling systems for electronic devices face issues such as pump lifespan limitations, contamination of the reservoir, and fluid leakage, which can lead to system shutdowns and damage to adjacent components during maintenance or replacement.

Innovation Solution

A cooling system design featuring a cold plate, heat exchanger, pumps, reservoir, and manifold with quick release connectors and check valves, allowing for continuous operation and maintenance without shutting down the system, as components like pumps and reservoirs can be removed and replaced without fluid leakage, using a carrier to contain leaked fluid and prevent damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the system is shut down for maintenance or pump replacement, then component reliability is improved, but system productivity deteriorates

Engineering Contradiction:
Improvecomponent reliabilityVSAvoidsystem productivity
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The cooling system is designed to maintain continuous cooling operation during pump replacement. The manifold includes bypass channels that allow fluid to flow around the pump being replaced, and quick-release connectors enable pump removal and installation without system shutdown, thus maintaining productivity while improving reliability through scheduled maintenance

Inventive Principle:
Principle #20Continuity of useful action

2Reliability

If the system is shut down for reservoir replacement, then contamination is prevented, but loss of time increases

Engineering Contradiction:
Improvefluid contamination preventionVSAvoidmaintenance time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The manifold incorporates bypass channels that enable fluid circulation to continue while the reservoir is being replaced. Quick-release connectors allow for rapid reservoir removal and installation, minimizing maintenance time while preventing fluid contamination through the bypass path

Inventive Principle:
Principle #20Continuity of useful action

3Ease of operation

If quick release connectors are used for pump removal, then ease of operation is improved, but fluid leakage risk increases

Engineering Contradiction:
Improvecomponent removal easeVSAvoidfluid leakage
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The manifold acts as an intermediary element that provides sealed bypass channels. When quick-release connectors are used to remove a pump, the bypass channels provide an alternative sealed path for fluid flow, preventing leakage while maintaining ease of operation

Inventive Principle:
Principle #24Intermediary (Mediator)

4Productivity

If reservoir capacity is increased to reduce refilling frequency, then productivity is improved, but device complexity increases

Engineering Contradiction:
Improverefilling frequencyVSAvoidreservoir capacity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The reservoir is designed with multi-functionality: it serves as both a fluid storage container and includes integrated fluid distribution channels that connect to the manifold. This allows a single component to fulfill multiple functions, increasing effective capacity without proportionally increasing overall system complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables continuous cooling of electronic devices during maintenance or component replacement, preventing fluid leakage and allowing for quick and easy replacement of components without shutting down the system, thus maintaining operational efficiency and preventing damage to adjacent components.

Implementation Method 1

a cold plate configured to thermally couple to a heat source and conduct heat from the heat source to a fluid

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat exchanger fluidly coupled to the cold plate is configured to dissipate heat from the fluid

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Implementation Method 3

A first pump and a second pump are configured to induce a flow in the fluid

Methodology Applied
Scientific EffectPumping: Pump

Data Source

PatentUS11465248B1System and method for removing components of a fluid cooling system during operation
Publication Date: 2022.10.11 CISCO TECHNOLOGY INC
  • US11465248B1 patent drawing
  • US11465248B1 patent drawing
  • US11465248B1 patent drawing

AI summary

Presented herein is a system including a cold plate configured to thermally couple to a heat source and conduct heat from the heat source to a fluid. A heat exchanger fluidly coupled to the cold plate is configured to dissipate heat from the fluid. A first pump and a second pump are configured to induce a flow in the fluid, and a reservoir is configured to store at least a portion of the fluid. A manifold is directly fluidly coupled to each of the cold plate, the heat exchanger, an inlet and an outlet of the first pump, an inlet and an outlet of the second pump and an inlet and an outlet of the reservoir.