Cooling Member for Substrate Holding in Supercritical Processing
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Solution Overview
Problem
In semiconductor device manufacturing, the use of supercritical processing with a heated holding member can cause the dry preventing liquid on a wafer to dry prematurely, preventing appropriate heating processing.
Innovation Solution
A substrate processing apparatus with a cooling member that cools the holding member and substrate, and a lift mechanism to move the cooling member and substrate support pin, ensuring the liquid on the wafer is not dried by heat, allowing for effective supercritical processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the holding member is heated to a high temperature for supercritical processing, then the supercritical processing effectiveness is improved, but the dry preventing liquid on the wafer is dried prematurely
Solution Approach 1:
The cooling function is separated from the heating function by introducing a dedicated cooling member that is distinct from the holding member. This segmentation allows the holding member to be heated for supercritical processing while the cooling member simultaneously cools the wafer to prevent premature drying of the dry preventing liquid.
Solution Approach 2:
The cooling member acts as an intermediary between the heated holding member and the wafer. It mediates the thermal interaction by absorbing excess heat from the holding member and transferring it to a cooling fluid, thereby preventing the wafer from being overheated while maintaining the holding member's high temperature for effective supercritical processing.
2Stability of the object's composition
If the holding member is cooled to prevent liquid drying, then the liquid retention is improved, but the supercritical processing effectiveness deteriorates
Solution Approach 1:
Different thermal conditions are applied to different locations: the cooling member contacts the wafer to maintain low temperature and prevent liquid drying, while the holding member is heated to high temperature for supercritical processing. This local differentiation of thermal properties resolves the contradiction between liquid retention and processing effectiveness.
3Reliability
If a cooling member is added to cool the holding member, then the liquid drying problem is solved, but the device complexity increases
Solution Approach 1:
The cooling member is integrated with the existing holding member structure, combining the cooling function with the holding function in a unified apparatus. This merging approach adds the necessary cooling capability while minimizing the increase in overall device complexity by sharing structural elements and support mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables appropriate heating processing on wafers with filled liquids by preventing drying of the liquid due to heat, ensuring consistent and effective supercritical processing.
Implementation Method 1
a cooling member configured to cool the holding member and the substrate
Implementation Method 2
a supercritical processing method using a fluid in a supercritical or subcritical state
Data Source
AI summary
Disclosed is a substrate processing apparatus. The substrate processing apparatus includes a container body, and a holding member that conveys the substrate from an outside of the container body into the container body and holds the substrate inside the container body during the processing. A substrate support pin supporting a wafer and a cooling plate cooling the holding member are provided outside the container body.