Power Semiconductor Cooling Module Busbar Heat Reflux
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In electric vehicles, heat generated by the motor is refluxed through the bus bar to the power semiconductor module, leading to performance degradation and potential damage due to inadequate cooling.
Innovation Solution
A power semiconductor cooling module with a housing, power element, heat dissipation parts, and a heat reflux prevention member made of plastic with heat radiation and insulation properties, which surrounds the bus bar to redirect refluxed heat to a cooling unit for efficient dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a copper bus bar is used to electrically connect the power module to the motor, then electrical conductivity is improved, but heat reflux from the motor to the power module occurs through the bus bar
Solution Approach 1:
A heat reflux prevention member is introduced as an intermediary component between the bus bar and the power module. This member intercepts heat flowing through the bus bar and redirects it toward the heat dissipation part, preventing heat from reaching the power module while maintaining electrical connectivity through the bus bar.
Solution Approach 2:
The harmful heat reflux function is extracted from the bus bar system by introducing a separate heat reflux prevention member. This member specifically targets and removes the heat transmission function from the bus bar, allowing the bus bar to maintain its electrical conductivity while the heat management function is handled by the dedicated prevention member.
2Productivity
If the power module is continuously operated, then productivity is improved, but heat accumulation degrades performance and reduces durability
Solution Approach 1:
The cooling system operates continuously alongside the power module, with the heat dissipation part and cooling unit constantly removing heat as it is generated. This continuous heat removal enables the power module to operate indefinitely without performance degradation, maintaining both productivity and reliability.
Solution Approach 2:
The heat reflux prevention member acts as a continuous intermediary that constantly intercepts and redirects heat away from the power module throughout operation, preventing heat accumulation that would otherwise lead to performance degradation during continuous operation.
3Object-affected harmful factors
If a heat reflux prevention member is added to block heat from the bus bar, then heat reflux is reduced, but device complexity increases
Solution Approach 1:
The heat reflux prevention member is integrated with the existing heat dissipation part, combining two functions (heat reflux prevention and heat dissipation) into a single integrated component. This reduces the number of separate parts and simplifies the overall structure while maintaining heat reflux prevention capability.
Solution Approach 2:
The heat reflux prevention member serves multiple functions: it blocks heat reflux from the bus bar, redirects heat toward the heat dissipation part, and integrates with the cooling system. This multi-functionality reduces the need for separate components and minimizes device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents overheating and performance degradation of the power semiconductor module by effectively transferring refluxed heat to the cooling unit, maintaining optimal temperatures and extending the module's durability.
Implementation Method 1
a heat dissipation part disposed in the internal space to be in contact with the power element part and configured to cool heat generated by the power element part
Implementation Method 2
a heat reflux prevention member disposed to surround at least a part of the entire length of the bus bar and disposed to be in contact with the heat dissipation part
Implementation Method 3
The heat reflux prevention member may be disposed so that at least one surface thereof is in surface contact with one surface of the cooling unit and may be directly cooled by the cooling unit
Implementation Method 4
The cooling unit may include a body in which a cooling water supplied from the outside is accommodated therein and an inlet and an outlet provided on one side of the body so that the cooling water is introduced or discharged through the inlet or the outlet, and the heat sink may be cooled through heat exchange with the cooling water
Data Source
AI summary
Provided is a power semiconductor cooling module for an electric vehicle. The power semiconductor cooling module for an electric vehicle, according to one exemplary embodiment of the present invention, is electrically connected to a motor and comprises: a box-shaped housing part having an inner space; a power element part disposed in the inner space and electrically connected to a motor via at least one busbar; a heat dissipation part disposed in the inner space so as to make contact with the power element part in order to cool heat generated from the power element part; and a heat backflow prevention member disposed so as to surround at least a portion of the total length of the busbar, and disposed so as to make contact with the heat dissipation part.