Cooling Module Assembly for Variable Chip Height Interfaces
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Solution Overview
Problem
Existing cooling modules struggle to effectively manage waste heat from electronic circuit modules with varying chip heights and flatness, leading to inefficient cooling and potential damage to chips due to inconsistent thermal interfaces and complex installation processes.
Innovation Solution
A cooling module design featuring a first and second cooling component, where the second component moves 3-dimensionally relative to the first to accommodate height and flatness variations, using spring-loaded fasteners and O-ring seals to establish consistent thermal interfaces, and fluid connectors to facilitate efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a fixed cooling component design is used, then manufacturing precision can be maintained, but adaptability to varying chip heights and flatness deteriorates
Solution Approach 1:
The cooling component incorporates a movable second cooling component that can shift position in response to varying chip heights and flatness. This dynamic adjustment capability allows the cooling component to adapt to different chip configurations while maintaining consistent thermal contact, resolving the contradiction between adaptability and manufacturing precision.
Solution Approach 2:
The system changes the positional parameter of the second cooling component to accommodate variations in chip geometry. By allowing the cooling component to move and adjust its position, the system maintains optimal thermal contact despite variations in chip height and flatness, thereby achieving both adaptability and thermal interface consistency.
2Reliability
If complex installation procedures are used, then reliability of fluid connections can be improved, but ease of operation deteriorates
Solution Approach 1:
The cooling module is divided into separable components with standardized fluid connectors. This segmentation allows for modular assembly and disassembly, enabling reliable fluid connections through simple connector interfaces rather than complex installation procedures, thus improving both reliability and ease of operation.
Solution Approach 2:
Standardized fluid connectors serve as intermediary elements between cooling components and fluid distribution systems. These connectors provide a reliable, pre-engineered interface that simplifies the installation process while ensuring leak-free connections, resolving the contradiction between connection reliability and installation simplicity.
3Adaptability or versatility
If rigid cooling components are used, then structural strength is maintained, but adaptability to varying chip geometries deteriorates
Solution Approach 1:
The cooling component system incorporates movable elements that can adjust their position dynamically. The second cooling component is designed to move in response to varying chip heights, allowing the rigid structure to adapt to different geometries while maintaining structural integrity through controlled, guided motion.
Solution Approach 2:
The system introduces positional adjustment in the vertical dimension to accommodate chip height variations. By allowing movement along the height axis while maintaining horizontal structural rigidity, the system achieves adaptability to varying chip geometries without compromising overall structural strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures efficient heat transfer and reduced chip damage by accommodating variations in chip height and flatness, simplifying installation, and improving factory and field serviceability.
Implementation Method 1
spring-loaded fasteners
Implementation Method 2
circulating a fluid (e.g., a cool fluid) to a cooling module of the circuit assembly to draw the waste-heat away from the electronic chips
Implementation Method 3
O-ring seals for secure and leak-proof fluid connections
Data Source
AI summary
Example implementations relate to a cooling module of a circuit assembly having a frame and an electronic circuit module including first and second chipsets, and a method of assembling the cooling module. The cooling module includes first and second cooling components. The first cooling component is connectable to the frame to establish a first thermal interface between the first cooling component and the first chipset. The first cooling component is positioned within a recess portion of the second cooling component, and each connector of a pair of second fluid connectors in the second cooling component is movably connected to a respective connector of a pair of first fluid connectors in the first cooling component to establish a fluid-flow path between the first and second cooling components. The second cooling component is connectable to the frame to establish a second thermal interface between the second cooling component and the second chipset.