Cooling Module With Movable Guide And Compressible Thermal Interface
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Solution Overview
Problem
Existing cooling modules face challenges in improving the cooling performance of electronic devices due to high thermal resistance between the device and the heat radiation member.
Innovation Solution
The proposed cooling module incorporates a substrate, a heat radiation member with a gap, a guide member, a fixing mechanism, and a compressively deformable heat conductive member. The heat conductive member is positioned between the heat radiation member and the guide member, overlapping with an opening in the guide member, allowing for efficient thermal coupling when the electronic device is inserted.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a heat conductive member is provided between the heat radiation member and the electronic device, then thermal contact is improved, but the device complexity increases
Solution Approach 1:
A heat conductive member is introduced as an intermediary between the heat radiation member and the electronic device. This mediator improves thermal contact by filling gaps and ensuring intimate thermal coupling, while the guide member provides a simple structural framework that accommodates the heat conductive member without significantly increasing overall complexity.
2Manufacturing precision
If the guide member is fixed rigidly to the heat radiation member, then positioning precision is improved, but the adaptability to different electronic devices decreases
Solution Approach 1:
The guide member is designed with movable characteristics, allowing it to adjust its position relative to the heat radiation member. This dynamic configuration enables the guide member to accommodate different electronic device sizes and positions while maintaining sufficient positioning precision through guided movement constraints.
3Temperature
If the gap between the heat radiation member and substrate is reduced, then cooling performance is improved, but the ease of electronic device insertion decreases
Solution Approach 1:
The gap space is segmented into functional zones: the guide member occupies part of the gap to provide guidance and positioning, while the heat conductive member fills the remaining thermal path. This segmentation allows the physical gap to remain large enough for easy insertion while the thermal path is minimized through the heat conductive member.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces thermal resistance by ensuring direct thermal contact between the electronic device and the heat radiation member via the heat conductive member, thereby enhancing the cooling performance of the electronic device.
Implementation Method 1
a compressively deformable heat conductive member that is disposed between the heat radiation member and the guide member
Data Source
AI summary
A cooling module includes a substrate, a heat radiation member fixed to the substrate with a gap between the heat radiation member and the substrate, a guide member that is disposed at a surface of the heat radiation member on a side of the substrate and that allows an electronic device to be inserted between the guide member and the substrate, a fixing mechanism that fixes the guide member to the heat radiation member so as to be movable in a direction in which the substrate and the guide member face each other, and a compressively deformable heat conductive member that is disposed between the heat radiation member and the guide member and overlaps with an opening provided in the guide member in a plan view.