Cooling Module Mountain-Valley Heat Sink for Airflow and Heat Transfer

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Solution Overview

Problem

Existing cooling modules face challenges in improving heat exhausting capacity while maintaining heat transfer efficiency, as reducing ventilation resistance in heat sinks with multiple heat pipes leads to decreased heat transfer efficiency.

Innovation Solution

The cooling module incorporates a heat sink design with notch and valley portions, along with laminated heat pipes, to reduce ventilation resistance while ensuring efficient heat transfer from heat pipes to fins, using a configuration that includes a valley portion recessed towards the first surface and mountain portions overlapping the heat pipes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the surface area of the fin is reduced to reduce ventilation resistance, then the ventilation resistance is reduced, but the heat transfer efficiency from the heat pipe to the fin is decreased

Engineering Contradiction:
Improveventilation resistanceVSAvoidheat transfer efficiency
Core Design Contradiction:
Manufacturing precisionVSTemperature

Solution Approach 1:

The fin structure is designed with varying surface areas at different locations. The first and second mountain portions have larger surface areas to enhance heat transfer from the heat pipes, while the valley portion has a smaller surface area to reduce ventilation resistance. This local differentiation allows each region to optimize for its specific function.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The fin is divided into multiple segments (first mountain portion, valley portion, second mountain portion) with different geometric characteristics. Each segment serves a specific purpose: mountain portions for heat absorption and valley portions for airflow optimization, thereby resolving the contradiction between heat transfer and ventilation resistance.

Inventive Principle:
Principle #1Segmentation

2Temperature

If the length of the fin in the flow direction is increased to improve heat transfer, then the heat transfer area is increased, but the ventilation resistance increases

Engineering Contradiction:
Improveheat transfer areaVSAvoidventilation resistance
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

Instead of uniformly increasing fin length, the design applies larger surface area locally at the mountain portions where heat pipes are connected, while keeping the valley portion shorter to maintain low ventilation resistance. This selective approach increases heat transfer area without proportionally increasing ventilation resistance.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The fin design transitions from a simple planar structure to a three-dimensional profile with varying height (mountain and valley portions). This dimensional variation allows the fin to optimize both heat transfer area and airflow characteristics simultaneously by creating regions of different thermal and fluid dynamic importance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances cooling performance by increasing exhaust air volume and reducing ventilation resistance, thereby improving heat transfer efficiency and extending the boost operation time of CPUs.

Implementation Method 1

a heat pipe that absorbs and transports the heat generated by the CPU or the like

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

a heat sink and a fan that exhaust the heat transported by the heat pipe to an outside of a chassis

Methodology Applied
Scientific EffectForced convection: Forced Convection

Data Source

PatentUS12376264B2Cooling module and electronic apparatus
Publication Date: 2025.07.29 LENOVO (SINGAPORE) PTE LTD
  • US12376264B2 patent drawing
  • US12376264B2 patent drawing
  • US12376264B2 patent drawing

AI summary

A cooling module includes a fan, a heat sink, and a first heat pipe and a second heat pipe that are connected to a first surface of the heat sink. The heat sink includes a valley portion in which the second surface is recessed toward a side of the first surface, a first mountain portion that is between the valley portion and the air introduction surface and has a greater height of the fin than the valley portion, and a second mountain portion that is between the valley portion and the air exhaust surface and has a greater height of the fin than the valley portion. The first mountain portion is disposed at a position overlapping the first heat pipe, and the second mountain portion is disposed at a position overlapping the second heat pipe.