Cooling Module Support Member for Liquid Cooling Leakage Prevention
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Solution Overview
Problem
Electronic system designs face challenges in balancing power density, spatial layout, temperature requirements, and acoustic noise, with liquid cooling being more efficient but risking leakage due to plumbing connections.
Innovation Solution
An apparatus with a support member and retaining member is designed to securely align and retain a cooling module, using a wet disconnect cooling method that transfers fluid between the cooling and electronic modules, with fluid supply and return lines and an overflow system to manage excess fluid and prevent leaks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling is used to efficiently remove heat from electronic components, then cooling efficiency is improved, but the risk of leakage increases due to plumbing connections
Solution Approach 1:
The cooling system is divided into separate modules (cooling module with fluid supply lines and return lines, electronic module with electronic components, overflow module as a separate containment structure) that can be independently assembled and tested. This segmentation allows for modular replacement and reduces the risk of system-wide leakage failures.
Solution Approach 2:
The overflow module is designed as a pre-positioned containment structure that receives excess fluid before it can cause damage to electronic components. This protective structure is installed in advance to cushion against potential leakage events, preventing harm rather than responding after leakage occurs.
2Use of energy by moving object
If plumbing connections are added to enable liquid cooling, then heat transfer capability is improved, but system complexity increases
Solution Approach 1:
The fluid supply lines and return lines are designed to serve multiple functions: they provide cooling fluid flow, establish mechanical connections between modules, and define fluid pathways without requiring separate dedicated structures for each function. This multi-functionality reduces overall system complexity despite the addition of cooling capabilities.
Solution Approach 2:
The cooling module with its fluid supply lines and return lines is designed to nest with the electronic module, with the cooling components integrated around or within the electronic component housing. This nesting arrangement eliminates the need for separate external plumbing and reduces system complexity through compact integration.
3Reliability
If fluid-tight connections are maintained to prevent leakage, then system reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The overflow module serves as a pre-installed safety structure that contains and directs excess fluid away from sensitive electronic components. This beforehand protective measure compensates for potential imperfections in fluid-tight connections by providing a secondary containment barrier that does not require perfect manufacturing precision to function effectively.
Solution Approach 2:
The overflow module acts as an intermediary structure between the cooling module and the electronic module, providing a buffer zone that manages fluid flow and prevents direct contact between leaked fluid and electronic components. This intermediary structure reduces the stringency of fluid-tight connection requirements by adding a protective intermediate layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively removes heat from electronic components using liquid cooling, reducing the risk of leakage and maintaining a fluid-tight connection, thus balancing cooling efficiency with reliability and visibility for leak detection.
Implementation Method 1
The cooling module removes heat from the electronic module
Implementation Method 2
The cooling module removes heat from the electronic module through fluid flow
Implementation Method 3
The cooling module receives the fluid from a supply, removes heat from the electronic module using the fluid
Data Source
AI summary
An apparatus to cool an electronic module is provided herein. The apparatus includes a support member and a retaining member. The support member to receive the cooling module. The support member includes a cooling module alignment member to align the cooling module therein. The retaining member to secure the cooling module.