Electronic Cooling Structure with Nested Heat Dissipating Fins

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Solution Overview

Problem

Conventional cooling structures for electronic devices face inefficiencies in heat dissipation due to clearances between male and female screw threads on heat dissipating members, which hinder effective heat transfer from the circuit substrate to the exterior.

Innovation Solution

A cooling structure with a first heat dissipating member and a second heat dissipating member, where the heat input blade member is fitted into the first heat dissipating blade member, eliminating clearances and enhancing contact for efficient heat transfer, and the second heat dissipating member is supported by the casing to reduce load on the first member.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If male screw members and female screw threads are provided in a concentric manner to connect heat dissipating members, then the structure can be assembled, but the machining complexity increases and clearances are formed that hinder heat transfer

Engineering Contradiction:
Improveassembly capabilityVSAvoidheat transfer efficiency
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent removes the screw threads and male screw members from the heat dissipating member structure. Instead of using threaded connections, the heat dissipating members are positioned and fixed using positioning protrusions and positioning grooves that engage directly without requiring threaded fastening, thereby eliminating the clearance problem while maintaining assembly capability

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent employs a nested structure where the second heat dissipating member is positioned over the first heat dissipating member through positioning protrusions and grooves. The positioning protrusion on the second member fits into the positioning groove on the first member, creating a tight fit that eliminates clearances and enables efficient heat transfer while maintaining structural assembly

Inventive Principle:
Principle #7Nested doll (Nesting)

2Ease of operation

If clearances are formed between male screw members and female screw threads, then assembly is possible, but heat transfer from lower to upper heat dissipating member is hindered

Engineering Contradiction:
Improveassembly feasibilityVSAvoidheat dissipation efficiency
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent extracts the threaded connection mechanism entirely from the heat dissipating member assembly. By replacing screw threads with direct positioning protrusion-groove engagement, the design eliminates clearances that would otherwise impede thermal contact while preserving the ability to assemble and disassemble the components

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the positioning and heat transfer functions into a single integrated structure. The positioning protrusions and grooves not only align and secure the heat dissipating members but also ensure direct thermal contact between them, combining mechanical fastening and thermal conduction into one unified mechanism

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for superior heat dissipation efficiency while maintaining a simple structure, effectively removing heat from the circuit substrate and reducing the risk of damage to electronic components.

Implementation Method 1

heat transfer from the first heat dissipating member to the second heat dissipating member... heat transfer part interposed between the heat input blade member and the second heat dissipating blade member, and which is adapted to transmit heat

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10231355B2Cooling structure for electronic device
Publication Date: 2019.03.12 FANUC LTD
  • US10231355B2 patent drawing
  • US10231355B2 patent drawing
  • US10231355B2 patent drawing

AI summary

A cooling structure for an electronic device is configured to include internal heat dissipating fins (first heat dissipating member) accommodated inside a casing together with being disposed on a printed circuit board serving as a circuit substrate, and external heat dissipating fins (second heat dissipating member), a portion of which is exposed externally of the casing. The external heat dissipating fins include a heat input blade member which is fitted into a first heat dissipating blade member that constitutes the internal heat dissipating fins, and a second heat dissipating blade member which is exposed externally of the casing. A heat transfer part adapted to transmit heat from the heat input blade member to the second heat dissipating blade member is interposed between the heat input blade member and the second heat dissipating blade member.