Phase-Change Cooling Panel with Uniform Liquid Return Paths
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Solution Overview
Problem
Existing heat dissipation systems for electronic devices, particularly those using aluminum alloys, face limitations in thermal conductivity, material cost, and environmental regulations due to the use of refrigerants like Honeywell or Freon, leading to inefficient heat dissipation and increased product size.
Innovation Solution
An active heat dissipation apparatus utilizing a thermal conduction panel body with refrigerant flow paths, including first and second refrigerant flow paths, and a metallic material like stainless steel (SUS) to enhance heat transfer and phase change capabilities, allowing the use of water as a refrigerant while minimizing thermal concentration and product thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum alloy materials are used for heat dissipation fins, then thermal conductivity is improved, but material cost increases and environmental regulations are violated due to refrigerant restrictions
Solution Approach 1:
The patent utilizes phase transition of water (liquid to vapor and back) as the refrigerant in the closed-loop heat dissipation system. Water evaporates at the heat generation element to absorb heat, then condenses at the heat dissipation fins to release heat, enabling effective heat transfer without using environmentally harmful refrigerants like Freon or Honeywell
Solution Approach 2:
The patent replaces expensive aluminum alloy materials with cheaper stainless steel (SUS) for the heat dissipation fins and panel body. While stainless steel has lower thermal conductivity than aluminum, the phase-change water cooling system compensates for this, achieving comparable or superior heat dissipation performance at reduced material cost
2Temperature
If aluminum alloy materials are used for heat dissipation fins, then thermal conductivity is improved, but manufacturing cost increases
Solution Approach 1:
The patent substitutes expensive aluminum alloy with inexpensive stainless steel (SUS) for manufacturing the heat dissipation fins and panel body. The lower material cost of stainless steel is offset by the high efficiency of the phase-change water cooling system, achieving cost-effective heat dissipation
Solution Approach 2:
The phase-change water cooling system provides such effective heat transfer that it compensates for the lower thermal conductivity of stainless steel compared to aluminum alloy, allowing the use of cheaper materials without sacrificing heat dissipation performance
3Temperature
If traditional heat dissipation systems are used, then heat dissipation is achieved, but product size increases due to thicker components
Solution Approach 1:
The phase-change water cooling system enables highly efficient heat transfer in a compact form factor. The latent heat of vaporization and condensation of water provides intense cooling capability within thin-walled structures, allowing effective heat dissipation without increasing product thickness
Solution Approach 2:
The patent employs thin-walled stainless steel panel body and heat dissipation fins in the phase-change cooling system. The thin walls do not compromise the heat dissipation effectiveness because the phase-change water cooling provides sufficient heat transfer capability, enabling product slimming while maintaining thermal performance
4Ease of manufacture
If stainless steel is used instead of aluminum alloy, then material cost is reduced, but thermal conductivity decreases
Solution Approach 1:
The phase-change water cooling system provides such effective heat transfer that it compensates for the lower thermal conductivity of stainless steel. The evaporative cooling and condensation processes transfer heat more efficiently than simple thermal conduction through aluminum alloy, offsetting the material's inferior thermal properties
Solution Approach 2:
The patent uses cheaper stainless steel materials to reduce manufacturing costs, and the high efficiency of the phase-change water cooling system compensates for the lower thermal conductivity, achieving cost-effective heat dissipation without sacrificing performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves improved heat dissipation performance, reduced manufacturing costs, and compliance with environmental regulations by maximizing heat transport ability and using water as a refrigerant, while maintaining or exceeding the performance of traditional systems.
Implementation Method 1
a first refrigerant flow path in which the thermal conduction panel body is supplied with heat from a heat generation element
Implementation Method 2
heat, which is generated from the elements during a power supply process, is dissipated to the outside
Implementation Method 3
a plurality of second refrigerant flow paths connected to the first refrigerant flow path and configured such that a liquid refrigerant in the refrigerant, which is condensed into a liquid state from a gaseous state, is uniformly supplied to the first refrigerant flow path
Implementation Method 4
a thermal conduction panel body having a refrigerant flow space with which a refrigerant is filled
Data Source
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AI summary
The present disclosure relates to an active heat dissipation apparatus and a method of manufacturing the same, the active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space with which a refrigerant is filled, in which the refrigerant flow space includes a first refrigerant flow path in which the thermal conduction panel body is supplied with heat from a heat generation element that is a heat dissipation target, and a plurality of second refrigerant flow paths connected to the first refrigerant flow path and configured such that a liquid refrigerant in the refrigerant, which is condensed into a liquid state from a gaseous state, is uniformly supplied to the first refrigerant flow path, thereby significantly improving heat dissipation performance.