Cooling Panel with Integrated Noise Attenuation for Power Electronics
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Solution Overview
Problem
Existing two-phase cooling systems for power electronic devices face limitations in cooling performance due to acoustic noise restrictions, which limit the maximum air speed and heat-transfer coefficient, necessitating additional components for noise attenuation that increase volume, weight, and cost.
Innovation Solution
Integrating sound attenuation into the condenser panels of the cooling system using perforated panels with Helmholtz resonators or holes that induce a vibrating air flow to attenuate noise through friction, allowing for higher power fans while maintaining noise limits without additional components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a fan is used to produce a mechanically generated air flow to achieve higher cooling performance, then the heat transfer coefficient is improved, but the acoustic noise increases strongly
Solution Approach 1:
The patent combines the noise attenuation function with the heat transfer function by integrating Helmholtz resonators directly into the cooling panels. This merging eliminates the need for separate noise attenuation components while maintaining effective cooling performance.
Solution Approach 2:
The cooling panels are designed to perform multiple functions simultaneously: they serve as heat transfer surfaces for cooling power electronic devices and as noise attenuation structures through integrated Helmholtz resonators. This multi-functionality allows the same component to address both cooling performance and noise reduction.
2Object-generated harmful factors
If additional components for attenuating noise are added to the air duct system, then the acoustic noise is reduced, but the volume, weight, and device complexity increase
Solution Approach 1:
The noise attenuation function is merged with the existing cooling panels, eliminating the need for separate noise attenuation components in the air duct system. The Helmholtz resonators are integrated directly into the panels that are already part of the cooling system.
Solution Approach 2:
The cooling panels are designed to perform multiple functions simultaneously: they serve as heat transfer surfaces for cooling power electronic devices and as noise attenuation structures through integrated Helmholtz resonators. This multi-functionality allows the same component to address both cooling performance and noise reduction.
3Object-generated harmful factors
If additional components for attenuating noise are added to the air duct system, then the acoustic noise is reduced, but the volume and weight increase
Solution Approach 1:
The noise attenuation function is merged with the existing cooling panels, eliminating the need for separate noise attenuation components in the air duct system. The Helmholtz resonators are integrated directly into the panels that are already part of the cooling system.
Solution Approach 2:
The cooling panels are designed to perform multiple functions simultaneously: they serve as heat transfer surfaces for cooling power electronic devices and as noise attenuation structures through integrated Helmholtz resonators. This multi-functionality allows the same component to address both cooling performance and noise reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances cooling performance by allowing the use of higher power fans while respecting noise limits, reducing the need for separate noise attenuation measures, and saving on volume, weight, and cost by combining heat transfer and sound attenuation in a single apparatus.
Implementation Method 1
the hole being adapted to attenuate a vibrating air pressure generated by an acoustic noise source and carried by air by inducing a vibrating air flow through the hole on excitation by the vibrating air pressure
Implementation Method 2
the at least one panel being adapted to be in thermal contact with an air flow in order to transfer heat from the at least one panel
Implementation Method 3
the at least one panel being adapted to be thermally connected to a heat source in order to receive heat from the heat source
Data Source
AI summary
Exemplary embodiments are directed to a cooling apparatus for cooling a power electronic device, the apparatus including at least one panel that is adapted to be thermally connected to a heat source in order to receive heat from the heat source. The panel is also adapted to be thermally in contact with an air flow in order to transfer heat from the panel. The panel includes at least one hole between a first side of the panel and a second side of the panel. The hole is adapted to attenuate a vibrating air pressure generated by an acoustic noise source and carried by the air.