Phase-Change Cooling Panel Layout for Water Refrigerant Heat Dissipation
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Solution Overview
Problem
Existing heat dissipation systems for electronic devices, particularly those using aluminum alloys, face limitations in thermal conductivity, material cost, and the need for expensive alternatives like copper and gold, while refrigerant-based systems face issues with chemical reactions and pressure buildup, restricting the use of water as a refrigerant due to environmental regulations.
Innovation Solution
The active heat dissipation apparatus employs a thermal conduction panel body made of stainless steel (SUS) with a refrigerant flow space designed to minimize thermal concentration and pressure buildup, using water as a refrigerant, and optimizing the flow paths to enhance heat dissipation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum alloy is used for heat dissipation fins, then thermal conductivity is improved, but material cost increases and chemical reactions with water refrigerant occur
Solution Approach 1:
The patent introduces a coating layer as an intermediary between the aluminum alloy heat dissipation fins and the water refrigerant. This coating prevents direct chemical contact between aluminum and water, eliminating harmful reactions while preserving the high thermal conductivity of aluminum alloy. The coating acts as a protective barrier that allows heat transfer to continue effectively without enabling chemical degradation.
Solution Approach 2:
The patent creates a composite structure by combining aluminum alloy with a protective coating material. This composite approach maintains the superior thermal conductivity properties of aluminum alloy while adding the chemical stability of the coating material, thereby resolving the contradiction between thermal performance and chemical reactivity with water refrigerant.
2Temperature
If copper or gold is used instead of aluminum, then thermal conductivity is improved, but manufacturing cost increases significantly
Solution Approach 1:
The patent employs a cost-effective aluminum alloy material rather than expensive copper or gold, accepting that aluminum has lower thermal conductivity but compensating through optimized heat dissipation fin design and configuration. This approach prioritizes manufacturing economy while achieving sufficient heat dissipation performance through structural optimization rather than relying on expensive materials.
Solution Approach 2:
The patent changes the parameters of the heat dissipation system by optimizing fin geometry, surface area, and arrangement to compensate for aluminum's lower thermal conductivity compared to copper or gold. By adjusting these parameters, the system achieves adequate thermal performance using the more economical aluminum alloy material.
3Object-affected harmful factors
If water is used as refrigerant, then environmental compliance is improved, but pressure buildup and chemical reactions occur
Solution Approach 1:
The patent uses a protective coating as an intermediary layer between the water refrigerant and the heat dissipation fins, preventing chemical reactions that would otherwise occur between water and aluminum. This coating barrier allows water to be used as a safe, environmentally compliant refrigerant without the risk of chemical degradation or pressure buildup from reaction byproducts.
Solution Approach 2:
The patent converts the potential harm of water's chemical reactivity with aluminum into a benefit by applying a protective coating that eliminates the reaction risk. This allows water's advantageous properties (environmental safety, availability, cost-effectiveness) to be fully utilized while neutralizing its harmful chemical reactivity through the coating barrier.
4Temperature
If heat dissipation fins are extended further from heat sources, then heat dissipation performance is improved, but device size increases
Solution Approach 1:
The patent implements a nested or integrated structure where heat dissipation fins are incorporated within or alongside the antenna housing rather than extending externally. This nesting approach allows heat dissipation functionality to be achieved without increasing the overall device thickness, as the fins utilize existing structural space efficiently.
Solution Approach 2:
The patent transitions from extending heat dissipation fins in the thickness direction (vertical dimension) to arranging fins in the horizontal plane or integrating them into the housing structure. This dimensional shift allows effective heat dissipation surface area to be increased without increasing device thickness, solving the contradiction between thermal performance and compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves improved heat dissipation performance, reduces manufacturing costs, and complies with environmental regulations by using water as a refrigerant, while maintaining or exceeding the performance of traditional aluminum-based systems.
Implementation Method 1
capable of improving heat dissipation performance by actively transferring heat, which is generated from a heat generation device (e.g., an electronic device), by means of a phase change of a refrigerant
Implementation Method 2
transferring heat... by means of a phase change of a refrigerant
Implementation Method 3
characteristics of a thermal conduction material of the active heat dissipation apparatus
Data Source
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AI summary
The present disclosure relates to an active heat dissipation apparatus and a method of manufacturing the same, the active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space in which a refrigerant is stored and flows, in which the refrigerant flow space includes a first refrigerant flow path having a vaporization zone in which the refrigerant changes from the liquid refrigerant to a gaseous refrigerant, and a plurality of second refrigerant flow paths provided in a condensation zone provided in a portion other than the first refrigerant flow path and configured to guide a flow of the liquid refrigerant, which is changed in phase from a gaseous phase to a liquid phase while exchanging heat with outside air of the thermal conduction panel body, to the vaporization zone, in which at least any one of one end and the other end of each of the plurality of second refrigerant flow paths is connected to the first refrigerant flow path formed in the vaporization zone or the vaporization zone, and positioned below the other of one end and the other end in a gravitational direction.