Liquid Immersion Cooling Partition Board Flow Guide
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Solution Overview
Problem
Existing liquid-immersion cooling devices for servers require additional cooling systems to supply coolant, increasing power consumption and costs due to the need for pumping and increased coolant requirements with longer distances between cooling devices and servers.
Innovation Solution
A liquid-immersion cooling device design that includes a reservoir with partition boards guiding coolant flow and integrated heat exchangers within the reservoir, eliminating the need for an external cooling device by utilizing natural convection and direct heat exchange, thereby simplifying the structure and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an additional external cooling device is used to supply coolant to the reservoir, then cooling function is provided, but power consumption increases due to pumping requirements
Solution Approach 1:
The cooling system uses natural convection where the coolant automatically circulates through the reservoir and heat exchanger without external pumping. The temperature difference between heated and cooled coolant creates natural flow, eliminating the need for energy-consuming pumps while maintaining effective cooling
Solution Approach 2:
The patent replaces the mechanical pumping system with a natural convection system. Instead of using mechanical force to move the coolant, the system relies on thermal buoyancy forces created by temperature differences, substituting a mechanical energy-intensive system with a passive thermal system
2Adaptability or versatility
If the distance between the cooling device and servers is increased, then server placement flexibility improves, but coolant quantity increases leading to higher costs
Solution Approach 1:
The heat exchanger is integrated directly within the reservoir structure, merging the cooling function with the server housing. This integration eliminates the need for long coolant supply lines, reducing coolant quantity while maintaining cooling effectiveness regardless of server placement within the reservoir
Solution Approach 2:
The reservoir structure serves multiple functions: it houses the servers, contains the coolant, and incorporates the heat exchanger functionality. This multi-functionality allows server placement flexibility within the reservoir without requiring additional coolant infrastructure
3Temperature
If an external cooling device is used, then cooling capability is provided, but device structure becomes more complex and costly
Solution Approach 1:
The heat exchanger is merged with the reservoir structure, forming an integrated cooling system. This combination eliminates separate external cooling components and their associated complex piping and mounting structures, simplifying the overall device while maintaining cooling capability
Solution Approach 2:
The reservoir is designed as a multi-functional component that simultaneously provides server housing, coolant containment, and heat exchange capabilities. This universal design eliminates the need for separate dedicated cooling devices, reducing structural complexity and component count
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances cooling efficiency and reduces costs by eliminating the need for external cooling devices and minimizing coolant requirements, while maintaining effective heat transfer through natural convection and optimized coolant flow.
Implementation Method 1
utilizing natural convection and direct heat exchange
Implementation Method 2
integrated heat exchangers within the reservoir
Data Source
AI summary
A liquid-immersion cooling device includes a reservoir, a partition board, and a heat exchanger. The reservoir contains coolant to immerse the electronic device. The partition board and the heat exchanger are mounted within the reservoir. The partition board is arranged parallel to the electronic device. The heat exchanger and the electronic device are respectively arranged on opposite sides of the partition board within the reservoir. The partition board is configured to guide a flow of the coolant within the reservoir. When the coolant flows through the electronic device and carries away heat generated by the electronic device, the coolant carrying the heat is guided by the partition board to flow through the heat exchanger. After exchanging heat with the heat exchanger, the coolant is guided by the partition board to flow through the electronic device.