Server Cooling Pipe Fixation Reducing Stress on Substrate Connections

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Solution Overview

Problem

Existing cooling systems for electronic components face challenges in reducing stress on connection pipes when forces are applied, leading to potential displacement and stress on connection portions to substrates.

Innovation Solution

A module and server design that incorporates a cooling unit, connection pipes, and a fixation portion strategically positioned to reduce stress from connection pipes to the cooling unit, with the fixation portion constraining movement and applying elastic forces to absorb displacement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If the cooling pipes are attached to a fixation block by a fixation angle attached to the edge of a printed circuit board, then the cooling pipes can be fixed in position, but stress is applied to the connection portion for connecting the end of the cooling pipe to the substrate when the connection pipe is displaced

Engineering Contradiction:

Improvefixation stabilityVSAvoidstress on connection portion

Core Design Contradiction:

Stability of the object's compositionVSStress or pressure

Solution Approach 1:

The fixation structure is divided into multiple independent fixation portions positioned at different locations along the connection pipe. Each fixation portion independently constrains the pipe, segmenting the stress transmission path and preventing concentrated stress at the substrate connection portion.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The fixation portions are positioned in advance to intercept and absorb displacement forces before they reach the substrate connection portion. This preemptive fixation acts as a cushioning mechanism that protects the vulnerable connection point from stress.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Stress or pressure

If the connection pipe is fixed at multiple positions, then stress on the connection portion can be reduced, but the device complexity increases

Engineering Contradiction:

Improvestress reductionVSAvoidfixation structure complexity

Core Design Contradiction:

Stress or pressureVSDevice complexity

Solution Approach 1:

The fixation portions serve multiple functions simultaneously: they fix the connection pipe in position, reduce stress on the substrate connection, and prevent displacement. This multi-functionality reduces the need for additional specialized components, thereby limiting the increase in device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The fixation portions are strategically positioned at specific locations where stress concentration occurs, rather than uniformly distributing fixation elements throughout the entire pipe. This localized approach optimizes stress reduction while minimizing the overall complexity of the fixation structure.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS11284536B2Module including fixation portion provided at position at which stress from connection pipe to cooling unit is reduced and server including the same

Publication Date: 2022.03.22 NEC PLATFROMS LTD

AI summary

A module including a cooling unit that cools a heat-generating component provided on a substrate; a connection pipe that is connected to the cooling unit; and a fixation portion that is provided at a position at which stress from the connection pipe to the cooling unit is reduced, and that fixes the connection pipe.