Cooling Plate Adhesive Composition for Coolant-Resistant Bonding

The patent changes the chemical composition parameters of the adhesive by incorporating hydrolyzable organosilane compounds (such as γ-glycidoxypropyltrimethoxysilane) that undergo hydrolysis and condensation reactions to form siloxane crosslinks. This transforms the adhesive from a simple epoxy formulation to one that dynamically adapts its molecular structure in response to coolant exposure, maintaining bond strength despite prolonged immersion in degrading environments.

The patent creates a composite adhesive system combining epoxy resin with hydrolyzable organosilane compounds. This composite formulation leverages the strong initial bonding of epoxy while adding the self-repairing crosslinking capability of silane chemistry, resulting in an adhesive that exhibits both high initial strength and long-term durability against coolant degradation.

The patent incorporates hydrolyzable organosilane groups into the adhesive formulation before application. These groups are pre-positioned to undergo hydrolysis and condensation reactions when exposed to moisture in the coolant environment, forming additional siloxane crosslinks that compensate for adhesive strength loss over time. The preliminary inclusion of these reactive groups enables the adhesive to self-reinforce during service.

The adhesive system performs self-service by utilizing the coolant environment itself (specifically the moisture content) to trigger hydrolysis and condensation reactions of the organosilane groups. This self-reinforcing mechanism automatically compensates for degradation without requiring external intervention, maintaining bonding strength throughout the service life of the cooling plate assembly.