Liquid Cooling Plate with Bosses for Electronic Devices
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Solution Overview
Problem
Traditional liquid cooling plates for electronic devices, such as hashboards and power boxes, only partially address heat dissipation needs, leading to poor heat dissipation effects and inconvenient mounting due to structural limitations, necessitating a more comprehensive solution to handle all heat loads without relying on fans.
Innovation Solution
A liquid cooling plate design featuring a planar first heat dissipation surface and a second surface with heat dissipation bosses, incorporating heat dissipation flow channels that form a cooling liquid flow path with an inlet and outlet, allowing for efficient liquid cooling by eliminating the need for fans and enabling complete heat dissipation from both surfaces of electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a traditional liquid cooling plate is mounted on the side of the electronic device with heating components, then the heat dissipation for that side is improved, but the other side still requires a fan for heat dissipation, resulting in incomplete heat dissipation solution
Solution Approach 1:
The cooling plate is divided into two distinct surfaces: a first surface with a planar structure for mounting on electronic devices without heating components, and a second surface with multiple heat dissipation bosses for mounting on surfaces with heating components. This segmentation allows each surface to be optimized for its specific function, enabling complete liquid cooling coverage without requiring fans.
Solution Approach 2:
The cooling plate is designed as a universal component that can be mounted on both surfaces of electronic devices. The first surface handles cooling for devices without heating components, while the second surface handles cooling for devices with heating components. This multi-functionality eliminates the need for separate cooling solutions and removes the requirement for fans.
2Temperature
If a liquid cooling plate is designed with both planar and boss surfaces, then complete heat dissipation coverage is achieved, but the manufacturing complexity increases
Solution Approach 1:
The cooling plate is segmented into two distinct surfaces with different structures: a planar first surface and a second surface with multiple heat dissipation bosses. This segmentation allows each surface to be manufactured using optimized processes for its specific requirements, while the overall design remains modular and manageable.
Solution Approach 2:
Different regions of the cooling plate have different local qualities: the first surface has a planar structure suitable for uniform heat distribution, while the second surface has localized heat dissipation bosses positioned at specific locations to target heating components. This local quality differentiation optimizes heat dissipation effectiveness without requiring complex manufacturing throughout the entire plate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides excellent heat dissipation performance, completely bearing the heat loads of electronic devices like hashboards and power boxes, ensuring uniform heat dissipation without the need for fans, thus improving both effectiveness and convenience in mounting and usage.
Implementation Method 1
Heat dissipation flow channels extending along the heat dissipation bosses are provided inside the liquid cooling plate body at positions corresponding to the at least one of the heat dissipation bosses between the first heat dissipation surface and the second heat dissipation surface
Implementation Method 2
the plurality of heat dissipation flow channels are connected to form a cooling liquid flow path provided with an inlet and an outlet
Data Source
AI summary
Disclosed are a liquid cooling plate suitable for liquid cooling heat dissipation of an electronic device and a heat dissipation unit. The liquid cooling plate includes a liquid cooling plate body and at least one heat dissipation flow channel, wherein the liquid cooling plate body is provided with a first heat dissipation surface and a second heat dissipation surface that are arranged in parallel, the first heat dissipation surface being planar, a plurality of heat dissipation bosses being arranged on the second heat dissipation surface, and heat dissipation flow channels extending along the heat dissipation bosses are provided inside the liquid cooling plate body at positions corresponding to the at least one of the heat dissipation bosses between the first heat dissipation surface and the second heat dissipation surface, the plurality of heat dissipation flow channels being connected to form a cooling liquid flow path having an inlet and an outlet.