Liquid Cooling Plate Flow Guide for Uniform Chip Temperatures
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Solution Overview
Problem
Existing liquid cooling solutions for high-performance computing servers fail to achieve temperature uniformity among various computing chips, leading to performance degradation and reduced operational lifespan.
Innovation Solution
A liquid cooling plate design with a flow guide structure and heat dissipation fins that evenly distribute medium flow across the width direction of the channel, ensuring consistent temperature distribution and reducing turbulence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If heat dissipation fins are incorporated within flow channels of the liquid cooling plate, then heat dissipation capability is improved, but temperature uniformity among computing chips deteriorates
Solution Approach 1:
The flow channel is segmented into multiple sub-channels by dividing walls with different heights, creating distinct flow paths that distribute coolant uniformly across different chip rows. This segmentation allows independent temperature control for different chip regions while maintaining overall heat dissipation efficiency.
Solution Approach 2:
Different regions of the cooling plate are designed with locally optimized features: some areas have higher heat dissipation fins for high-heat chips, while other areas use divided sub-channels for uniform cooling. The channel end walls and dividing walls create localized flow control zones that adapt to specific thermal requirements of different chip positions.
2Power
If liquid cooling plates are employed to dissipate heat from hash chips, then heat dissipation is improved, but temperature uniformity requirements are not satisfied
Solution Approach 1:
The cooling plate divides the flow channel into multiple sub-channels using dividing walls of different heights, ensuring uniform coolant distribution across different chip rows. This segmentation addresses the temperature uniformity issue by creating balanced thermal zones.
Solution Approach 2:
The invention introduces vertical dimension variation through channel end walls and dividing walls with different heights, creating a three-dimensional flow distribution structure. This vertical stratification enables precise control of coolant flow paths to achieve uniform temperature distribution across the chip array.
3Power
If medium flow is increased to improve heat dissipation, then heat dissipation performance is improved, but flow distribution uniformity across width direction deteriorates
Solution Approach 1:
The flow channel is divided into multiple sub-channels that independently distribute coolant across the width direction. This segmentation ensures that increased flow rate is evenly distributed to all chip rows, maintaining flow distribution uniformity while improving overall heat dissipation performance.
Solution Approach 2:
Channel end walls are positioned at specific locations to pre-distribute the coolant flow before it reaches the heat dissipation fins. This preliminary flow distribution action ensures uniform coolant delivery to all sub-channels, preventing flow maldistribution even at high flow rates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation performance by maintaining consistent temperatures across the width of the cooling channel, improving the performance and extending the lifespan of hash chips.
Implementation Method 1
the liquid cooling plate includes a medium flow channel, heat dissipation fins, and a flow guide structure
Implementation Method 2
the medium flow channel is arranged corresponding to the chipsets; the heat dissipation fins are arranged within the medium flow channel
Implementation Method 3
the flow guide structure is arranged at least between one of the channel end walls and the heat dissipation fins, and the flow guide structure is evenly spaced apart from the channel end wall on a side where the flow guide structure is disposed and from the heat dissipation fins
Implementation Method 4
enhance the uniformity of a medium in the liquid cooling plate across a width direction of a flow channel and improve capabilities of hash chips
Data Source
Figure 1
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AI summary
Disclosed is a liquid cooling plate for a computing server, a computing liquid cooling unit, a computing server, and a data center. The liquid cooling plate comprises a medium flow channel, heat dissipation fins, and a flow guide structure. The medium flow channel has channel end walls, wherein medium ports are arranged in the channel end walls. The heat dissipation fins are arranged within the medium flow channel and are disposed between the channel end walls, dividing the medium flow channel into a plurality of sub-flow channels. The flow guide structure is arranged at least between one of the channel end walls and the heat dissipation fins, and the flow guide structure is evenly spaced apart from the channel end wall on a side where the flow guide structure is disposed and from the heat dissipation fins.