Cooling Plate Guide Groove for Substrate Pressure Equalization
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Solution Overview
Problem
The existing bake apparatuses for integrated circuit manufacturing face issues with substrate damage and positional accuracy due to pressure changes during cooling and heating processes, where the lift pin applies strong forces to substrates and air flow restrictions cause misalignment, especially with larger substrate diameters.
Innovation Solution
A bake unit with a cooling plate featuring a guide groove to direct exterior air into the space between the substrate and the plate, maintaining equal inner and outer pressures and preventing substrate damage, and lift pins moving through pin holes to manage air flow and substrate positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the substrate is cooled on the cooling plate, then the substrate is cooled down, but the inner pressure of the space becomes vacuum or lower than outer pressure causing substrate damage
Solution Approach 1:
A guide groove is introduced as an intermediary structure that allows external air to flow into the space between the substrate and cooling plate. This mediator (air flow through guide groove) balances the pressure difference created by cooling, preventing substrate damage while maintaining the cooling function.
Solution Approach 2:
The harmful vacuum pressure is extracted or released by allowing air to enter the space through the guide groove. This removes the adverse pressure condition that would otherwise cause substrate damage during the cooling process.
2Ease of operation
If the lift pin descends to load substrate on cooling plate, then substrate is positioned, but air flow path narrows causing substrate misalignment
Solution Approach 1:
The guide groove acts as an intermediary air channel that maintains proper air flow during substrate loading. By providing a dedicated path for air to escape, it prevents pressure buildup that would cause substrate misalignment, ensuring positioning accuracy while maintaining ease of operation.
3Manufacturing precision
If the lift pin descends slowly to allow air flow, then substrate positioning is maintained, but process time increases
Solution Approach 1:
The air flow path is segmented into a dedicated guide groove, separating the air flow function from the substrate contact area. This allows air to flow efficiently without requiring slow lift pin descent, maintaining positioning accuracy while reducing process time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents substrate damage during unloading and maintains positional accuracy by equalizing internal and external pressures, allowing for safe handling and efficient processing of substrates without increasing process time.
Implementation Method 1
A guide path is formed at a top surface of the plate for guiding exterior air to a space formed between the substrate and the plate when the substrate is loaded on the plate
Implementation Method 2
a cooling step in which substrates are cooled by means of a cooling plate
Implementation Method 3
a heating step in which substrates are heated by means of a heating plate
Data Source
AI summary
A bake unit includes a cooling plate for cooling a substrate and a lift pin assembly for loading a substrate on the cooling plate. When a wafer is cooled on the cooling plate, a guide groove is formed at the cooling plate to allow a space between the wafer and the cooling plate to communicate with the exterior. Thus, an inner pressure of the space is maintained to be equal to an outer pressure thereof.