Cooling-Plate Heater Block for Uniform Wafer Temperature Control
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Solution Overview
Problem
Existing substrate heating devices face challenges in accurately measuring the temperature of silicon wafers due to light transmission at temperatures below 600°C, and they lack precise control over smaller control areas, leading to temperature measurement errors and uneven heating.
Innovation Solution
A heater block with excellent heat dissipation characteristics, featuring a cooling plate with cooling passages for water flow, multiple light emitting modules for precise heating, and power supply modules that can independently control each area, improving temperature uniformity and precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a single halogen lamp is used for heating, then the heating coverage is large, but precise control for each control area is impossible
Solution Approach 1:
The single halogen lamp is divided into multiple light emitting modules, each capable of independent control. This segmentation allows different regions to be heated with different power levels, enabling precise temperature control for each control area while maintaining large heating coverage through the collective operation of all modules.
Solution Approach 2:
The system transitions from a static single-lamp configuration to a dynamic multi-module configuration where each module's power can be independently adjusted. This dynamic control capability allows real-time optimization of temperature distribution across different areas, resolving the contradiction between large coverage and precise control.
2Manufacturing precision
If multiple light emitting modules are used for precise area control, then temperature control precision is improved, but heat dissipation becomes more difficult
Solution Approach 1:
Multiple light emitting modules are merged onto a single cooling plate that provides unified heat dissipation. The cooling plate consolidates the thermal management function for all modules, efficiently removing heat from multiple sources simultaneously. This merging approach maintains precise temperature control through individual module power adjustment while solving the heat dissipation challenge through a shared cooling system.
3Productivity
If silicon wafer is used as substrate at temperature of 600°C or less, then heating process is efficient, but light transmission causes temperature measurement error
Solution Approach 1:
The substrate surface is divided into multiple control areas corresponding to different light emitting modules. By segmenting the heating zones, the system can apply different power levels to different regions, enabling more efficient heating processes while the distributed measurement approach (multiple pyrometers corresponding to different areas) reduces measurement errors caused by light transmission through the silicon wafer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively removes heat from light emitting and power supply modules, allowing for precise control of heating temperatures and power supply to each area, thereby enhancing temperature uniformity and reducing measurement errors.
Implementation Method 1
a cooling plate provided with a cooling passage through which cooling water flows
Implementation Method 2
a plurality of light emitting modules provided on a first surface of the cooling plate to emit light toward an object to be heated
Implementation Method 3
The pyrometer may collect radiant energy emitted from the substrate to measure the temperature of the substrate in the non-contact manner based on a blackbody radiation temperature relationship
Implementation Method 4
an electrode rod part electrically connected to the terminal part to extend from a bottom surface of the body part, wherein the electrode rod part may be connected to the corresponding light emitting module by passing through the cooling plate
Data Source
AI summary
The present disclosure relates to a heater block and an apparatus for heating a substrate having the same, and more particularly, to a heater block having excellent heat dissipation characteristics and capable of precisely controlling a heating temperature, and an apparatus for heating a substrate having the same. A heater block according to an exemplary embodiment includes a cooling plate provided with a cooling passage through which cooling water flows, a plurality of light emitting modules provided on a first surface of the cooling plate to emit light toward an object to be heated, and a plurality of power supply modules provided on a second surface of the cooling plate and electrically connected to the plurality of light emitting modules by passing through the cooling plate to supply power.