Cooling Plate Composition to Reduce Surface Pits and Heat Variation
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Solution Overview
Problem
Cooling plates made of composite materials used in semiconductor manufacturing often have surface pits that act as starting points for breakage and cause temperature variations, reducing temperature uniformity.
Innovation Solution
A cooling plate composition comprising 42% to 65% TiSi2, 4% to 16% TiC, and a smaller amount of SiC, with specific mass ratios and properties to minimize surface pits and enhance thermal conductivity, while maintaining a low thermal expansion coefficient for compatibility with alumina substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cooling plate is made of composite material containing silicon carbide, titanium silicide, titanium silicon carbide, or titanium carbide, then good material properties are achieved, but surface pits occur that reduce temperature uniformity and increase breakage risk
Solution Approach 1:
The invention changes the compositional parameters by specifying precise mass ratios: TiSi2 at 42-65%, TiC at 4-16%, and SiC at a smaller amount than TiSi2, with SiC/TiSi2 mass ratio of 0.47-0.98 and SiC/TiC mass ratio of 2.7-8.8. This parameter optimization resolves the contradiction by achieving both good material properties and reduced surface pits through controlled composition
Solution Approach 2:
The invention uses a composite material system comprising TiSi2, TiC, and SiC in specific proportions. This composite approach resolves the contradiction by combining multiple materials with complementary properties: TiSi2 provides thermal conductivity, TiC enhances strength, and controlled SiC content prevents excessive pit formation while maintaining overall material performance
2Strength
If surface pits are present on the cooling plate, then material properties may be maintained, but breakage occurs starting from pits and temperature variations increase
Solution Approach 1:
The invention optimizes the SiC content parameter, specifying it should be a smaller amount than TiSi2 with specific mass ratios (SiC/TiSi2: 0.47-0.98, SiC/TiC: 2.7-8.8). This parameter control reduces surface pit formation while maintaining the strength contributions from TiC and TiSi2, thereby improving breakage resistance without sacrificing material strength
3Quantity of substance
If surface pits are present on the cooling plate, then material composition may be maintained, but temperature uniformity decreases due to reduced heat conduction around pits
Solution Approach 1:
The invention changes the compositional parameters to minimize surface defects. By controlling TiSi2 at 42-65%, TiC at 4-16%, and SiC at a smaller amount than TiSi2 with specific ratios, the material achieves dense microstructure with fewer pits, thereby maintaining high heat conduction and temperature uniformity across the cooling plate surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cooling plate exhibits improved material properties, reduced pit occurrence, and minimal temperature variations, ensuring durability and efficient heat dissipation, with a low likelihood of separation from alumina substrates even under temperature fluctuations.
Implementation Method 1
the cooling plate has good material properties and therefore has a high ability to cool an object
Implementation Method 2
the cooling plate has good material properties and therefore has a high ability to cool an object
Data Source
AI summary
A cooling plate according to the present invention contains 42% to 65% by mass of TiSi2, 4% to 16% by mass of TiC, and a smaller amount of SiC than the mass percentage of TiSi2.