Cooling Plate Power Module Pack for Precise Solder Alignment
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Solution Overview
Problem
Existing power modules in inverters for hybrid and electric vehicles face challenges in heat dissipation due to high heat generation, leading to inefficiencies and increased manufacturing costs and defects.
Innovation Solution
A power module pack design featuring a first and second cooling plate with interposed power modules, preform soldering, engraved patterns, and embossed projections for precise alignment, along with a simplified soldering process using a pressure jig, enhances heat dissipation and reduces manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If power modules are disposed on an inverter heat sink for heat dissipation, then heat dissipation performance is improved, but manufacturing complexity and defect rates increase due to alignment difficulties
Solution Approach 1:
Engraved patterns are pre-formed on the heat sink surface before power module assembly. These patterns create physical guides that automatically align power modules during installation, eliminating alignment difficulties and reducing manufacturing complexity while maintaining effective heat dissipation contact.
Solution Approach 2:
A soldering support structure with engraved patterns acts as an intermediary between the heat sink and power modules. This structure provides both mechanical support and alignment guidance, ensuring precise positioning without requiring complex external alignment tools or procedures.
2Temperature
If power modules are soldered to cooling plates, then heat dissipation is improved, but manufacturing defects increase due to soldering process complexity
Solution Approach 1:
A pressure applying device uses pneumatic pressure to uniformly press the power modules onto the soldering support structure during soldering. This ensures consistent contact and solder distribution, reducing voids and defects while maintaining effective thermal contact between power modules and cooling plates.
Solution Approach 2:
The soldering process utilizes controlled pressure as a variable parameter to optimize solder joint quality. By applying uniform pressure during soldering, the process achieves reliable thermal contact and minimizes defects such as incomplete bonding or excessive void formation.
3Temperature
If precise alignment of power modules is achieved, then heat dissipation efficiency is improved, but manufacturing time and cost increase
Solution Approach 1:
The engraved patterns on the soldering support structure provide self-aligning features that automatically guide power modules into correct positions during assembly. This self-service alignment mechanism eliminates the need for time-consuming manual measurement and adjustment, reducing manufacturing time while ensuring precise alignment for optimal heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation performance, reduces manufacturing costs, and decreases defects by ensuring precise alignment and integration of components, thereby enhancing the overall efficiency and yield of power modules.
Implementation Method 1
Each of the power modules has a lower surface soldered to an upper surface of the first cooling plate. A preform solder may be disposed between the lower surface of each of the power modules and the upper surface of the first cooling plate, and each of the power modules may be soldered to the first cooling plate by the preform solder.
Implementation Method 2
the power module is disposed on an inverter heat sink provided in an inverter housing for heat dissipation, such that the heat generated by the power module is cooled
Implementation Method 3
a first coolant flow channel through which a coolant flows between the first cooling plate and the first cover, and a second cover stacked on and coupled to an upper surface of the second cooling plate to form a second coolant flow channel through which a coolant flows
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
Disclosed is a power module pack including a first cooling plate, a second cooling plate stacked on and coupled to the first cooling plate, and power modules interposed between the first cooling plate and the second cooling plate. Each of the power modules has a lower surface soldered to an upper surface of the first cooling plate.