Cooling Plate Rib Structure for Turbulent Heat Dissipation

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Solution Overview

Problem

Traditional heat dissipation structures for power semiconductor modules fail to enhance the convective heat transfer coefficient and heat dissipation area effectively, leading to inadequate thermal reliability and reduced service life.

Innovation Solution

A heat dissipation structure for power semiconductor modules featuring a straight rib mechanism and a pin rib mechanism on the cooling plate, which transitions fluid flow from laminar to turbulent, enhancing convective heat transfer and increasing the heat dissipation area.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a conventional cooling plate with flat heat dissipation surface is used, then the structure is simple and easy to manufacture, but the heat dissipation efficiency is insufficient and hot spots occur

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The heat dissipation surface is divided into multiple protruding structures (first protrusions and second protrusions) that segment the continuous surface into discrete thermal pathways. This segmentation increases the effective heat dissipation area and improves thermal distribution without requiring an entirely complex structural redesign.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The cooling plate transitions from a two-dimensional flat surface to a three-dimensional structure with protrusions having specific heights (first height h1 and second height h2). This dimensional change adds vertical thermal pathways while maintaining manufacturing feasibility through controlled protrusion geometries.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If the cooling plate structure is made complex to improve heat dissipation, then heat dissipation efficiency improves, but the manufacturing difficulty increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmanufacturing difficulty

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

Different regions of the cooling plate have different local structures: first protrusions with height h1 in certain regions and second protrusions with height h2 in other regions. This local differentiation optimizes heat dissipation in specific areas while maintaining overall manufacturing simplicity through standardized protrusion designs.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent specifies particular parameter ranges for protrusion heights (h1 and h2) and their spatial relationships to achieve optimal heat dissipation. By constraining these parameters within defined ranges, the design remains manufacturable while maximizing thermal performance.

Inventive Principle:

Principle #35Parameter changes

3Temperature

If protrusions are added to the cooling plate to increase heat dissipation area, then heat dissipation efficiency improves, but the thermal contact resistance may increase

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidthermal contact resistance

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent addresses thermal contact resistance by designing protrusions with specific height ratios (h2 > h1) and spatial arrangements that ensure adequate contact pressure and thermal conductivity at interfaces. The taller second protrusions compensate for any gaps or irregularities, converting potential contact resistance into effective thermal pathways.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The structure significantly improves heat dissipation performance, thermal reliability, and service life by increasing the convective heat transfer coefficient and heat dissipation area, transitioning fluid flow from laminar to turbulent.

Implementation Method 1

a cooling plate (10) comprising a chip carrier (11), a first cooling plate (12) extending along a first direction and disposed on a first surface of the chip carrier (11), and a second cooling plate (13) extending along a second direction and disposed on a second surface of the chip carrier (11)

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP4203014B1Heat dissipation structure of cooling plate for power semiconductor module

Publication Date: 2026.02.25 ZHENGHAI GRP CO LTD

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AI summary

A heat dissipation structure of a cooling plate for a power semiconductor module, the present heat dissipation structure comprising a power chip, a first solder layer, a copper-clad ceramic substrate, a second solder layer and a cooling plate body, which are sequentially arranged from top to bottom. The heat dissipation structure further comprises a straight rib mechanism and a pin rib mechanism, wherein the straight rib mechanism is arranged on a bottom surface of the cooling plate body, and the pin rib mechanism is arranged on the surface of a straight rib mechanism. The heat dissipation structure overcomes the defects of a traditional flat-plate cooling plate, effectively increases the convection heat exchange coefficient and heat dissipation area of the fluid-solid contact surface, increases the transferred heat caused by the macroscopic flow of the fluid and the delivered heat generated by the heat conduction of molecules in the fluid, enhances the heat dissipation performance of the power semiconductor module, improves the thermal reliability of the power semiconductor module, and prolongs the service life thereof.