Cooling Plate Runner Structure for Memory Module Heat Dissipation
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Solution Overview
Problem
Existing heat dissipation plate structures for memory storage devices have low heat dissipation efficiency.
Innovation Solution
A heat dissipation device comprising cooling boards and confluence connectors that enhance heat transfer through runners and a heat conducting plate, with a design that allows for improved heat absorption and distribution across multiple thermal elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a heat dissipation plate structure is provided to absorb heat from memory storage, then heat absorption function is achieved, but heat dissipation efficiency is low
Solution Approach 1:
The heat dissipation plate is divided into multiple segments with different structures. Some segments include heat dissipation fins extending outward, while others have heat conduction channels. This segmentation allows different regions to perform specialized functions (radiation vs. conduction), thereby improving overall heat dissipation efficiency without requiring a completely complex new structure.
Solution Approach 2:
The patent introduces vertical heat dissipation fins that extend outward from the plate surface, adding a third dimension to the traditionally flat heat dissipation structure. This dimensional change significantly increases the heat dissipation surface area and improves efficiency without proportionally increasing structural complexity.
2Loss of energy
If multiple thermal elements are installed, then heat dissipation capacity increases, but installation and disassembly become difficult
Solution Approach 1:
The heat dissipation device is designed as modular segments that can be independently installed and removed. Each segment can accommodate thermal elements, and the modular design allows for easy installation and disassembly of multiple thermal elements without requiring complex assembly procedures.
Solution Approach 2:
The heat dissipation plate structure is designed to universally accommodate multiple types of thermal elements (such as memory modules) through standardized interfaces and mounting mechanisms. This universality allows different thermal elements to be installed and removed easily while maintaining effective heat dissipation across all positions.
3Loss of energy
If heat dissipation surface area is increased, then heat dissipation efficiency improves, but device volume increases
Solution Approach 1:
Instead of expanding the heat dissipation surface area horizontally which would increase device footprint, the patent extends heat dissipation fins vertically outward from the plate surface. This utilizes the vertical dimension to increase surface area for heat radiation without significantly increasing the overall device volume, thereby improving heat dissipation efficiency while maintaining compact dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency by improving heat transfer and distribution, facilitating easy installation and disassembly of multiple thermal elements while maintaining a compact design.
Implementation Method 1
The cooling board (11) is attached to a thermal element (10), and the one or more cooling boards (11) absorb heat from the thermal element (10)
Implementation Method 2
two confluence connectors (13)... Two opposite ends of the first runner (111) are respectively connected to the corresponding second runner (131) of each of the two confluence connectors (13) to form a cooling runner (16)
Data Source
AI summary
A heating dissipation device comprising a cooling board and two confluence connectors, wherein the cooling board is configured to attach with a thermal element, and the cooling board absorbs heat from the thermal element, and the cooling board and the thermal element are spaced apart in a first direction; the two confluence connectors are respectively connected to two opposite ends of the cooling board along a second direction, the second direction is perpendicular to the first direction; the cooling board defines a first runner, and the first runner is passed through the cooling board in the second direction; each of the two confluence connectors defines a second runner, two opposite ends of the first runner are respectively connected to two second runners of the two confluence connectors to form a cooling runner.