Semiconductor Module Cooling Plate With Local Thickness Control
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Solution Overview
Problem
The top plate of cooling devices in semiconductor modules is made thick to ensure rigidity and prevent liquid leakage due to corrosion, but this thickness reduces heat dissipation and cooling performance.
Innovation Solution
A semiconductor device with a top plate that is thinner in the cooling region and thicker in the outer edge regions, featuring stepped portions to maintain rigidity and corrosion resistance while enhancing cooling performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the top plate is made thick to ensure rigidity and prevent liquid leakage, then structural strength and corrosion resistance are improved, but heat dissipation performance deteriorates
Solution Approach 1:
The top plate is designed with non-uniform thickness: thicker in the outer edge regions (for rigidity and corrosion resistance) and thinner in the cooling region (for heat dissipation). This local differentiation allows each region to optimize its function without compromising overall structural integrity.
2Reliability
If the top plate is made thick to prevent liquid leakage due to corrosion, then reliability is improved, but cooling performance deteriorates
Solution Approach 1:
The top plate implements localized thickness variation where the outer edge regions maintain greater thickness for corrosion resistance and reliability, while the cooling region features reduced thickness to enhance thermal conductivity and cooling efficiency.
3Temperature
If the top plate is made thinner to improve heat dissipation, then cooling performance is improved, but rigidity and corrosion resistance deteriorate
Solution Approach 1:
The top plate is designed with spatially varying thickness where the cooling region has reduced thickness to maximize heat dissipation, while the outer edge regions maintain sufficient thickness to provide the necessary rigidity and structural support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents a reduction in cooling performance, thereby maintaining the reliability of the semiconductor device.
Implementation Method 1
heat from the semiconductor module is transferred to the heat dissipating fins through the top plate
Implementation Method 2
coolant flowing from the inlet to the inside of the cooling device is circulated such that the coolant flows between the plurality of heat dissipating fins inside the cooling device
Data Source
Figure 1
Figure 2
Figure 3
AI summary
To prevent a reduction in cooling performance while ensuring rigidity and corrosion resistance. A top plate (21) is rectangular in plan view and has a cooling region (21b) and communicating regions (21c and 21d) set on the rear surface thereof, the cooling region (21b) extending in the long-side direction at the central portion of the rear surface and being where a plurality of heat dissipating fins (24f) are disposed, the communicating regions (21c and 21d) being set on both sides of the cooling region (21b). A sidewall (22) is connected to the rear surface of the top plate (21) in a loop shape so as to surround the cooling region (21b) and communicating regions (21c and 21d). The thickness (T2) in the cooling region (21b) of the top plate (21) is thinner than the thickness (T1) in outer edge regions (21e and 21f) of the top plate (21) located outside the sidewall (22). Therefore, the distance from the front surface of the top plate (21) in the cooling region (21b) to the plurality of heat dissipating fins (24f) is shortened. This facilitates transfer of heat of semiconductor modules (10) to the plurality of heat dissipating fins (24f) and thus improves cooling performance using coolant.