Circuit Board Cooling Plate Wedge Thermal Conduction
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Solution Overview
Problem
Existing cooling systems for circuit boards, such as VPX, VME, and custom PCI modules, face inefficiencies in heat dissipation, particularly with passive cooling methods that rely on heat sinks, as they often fail to provide satisfactory cooling performance due to limited heat transfer surfaces.
Innovation Solution
A cooling system comprising a casing with board slots, a cooling plate, a cover with wedges for thermal conductivity, and a wedgelock to secure the circuit board, allowing for efficient heat transfer from the board to the casing through a high surface area, enhancing thermal conductivity and dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If passive cooling systems with heat sinks are used, then volume is reduced and noise is minimized, but cooling performance is insufficient due to limited heat transfer surface area
Solution Approach 1:
The patent combines multiple functional elements into an integrated cooling structure: the cooling plate merges with the casing to form a unified heat dissipation system, while the wedge and cover are integrated to create both mechanical retention and thermal conduction pathways. This merging increases the effective heat transfer surface area without proportionally increasing volume, resolving the contradiction between compact size and cooling performance.
Solution Approach 2:
The invention transitions from traditional two-dimensional heat sink surfaces to a three-dimensional cooling architecture. The cooling plate extends through the casing with thermal contact on multiple faces, and the wedge provides additional thermal conduction paths from the circuit board edge. This dimensional expansion significantly increases heat transfer surface area within the same volume envelope.
2Temperature
If active cooling with fans is used, then cooling performance is improved, but noise increases and volume increases
Solution Approach 1:
The cooling system is designed to be self-sufficient without requiring external power sources or active components. The thermal conduction pathway from circuit board through wedge and cover to cooling plate operates passively based on temperature gradients alone. This self-service approach eliminates fan-related noise while maintaining effective cooling performance through optimized thermal contact surfaces.
Solution Approach 2:
The patent replaces the mechanical active cooling system (fans, motors, power supplies) with a passive thermal conduction system. Heat is transferred through solid thermal pathways (wedge, cover, cooling plate) rather than forced convection through moving air. This substitution eliminates the harmful noise factor while achieving comparable or superior cooling efficiency through increased thermal contact area.
3Strength
If wedgelock is used to secure circuit board, then mechanical retention is achieved, but thermal conduction path is limited to edge only
Solution Approach 1:
The wedge element is designed to perform multiple functions simultaneously: it provides mechanical retention of the circuit board (original wedgelock function) while also serving as a thermal conduction pathway. The cover is similarly multi-functional, providing both structural support and additional thermal contact surface. This multi-functionality resolves the contradiction by making the mechanical retention system also contribute to cooling performance.
Solution Approach 2:
The patent merges the mechanical retention function and thermal conduction function into a single integrated structure. The wedge and cover are not separate fastening components but are designed as thermal pathways from the outset. This merging allows the same elements that secure the circuit board to also conduct heat away from it, simultaneously achieving strong mechanical retention and reliable cooling performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves high cooling performance by effectively transferring heat from the circuit board to the casing via the cooling plate and wedge, providing a more efficient and silent cooling solution compared to traditional active cooling methods.
Implementation Method 1
at least one wedge placed on said cover, wherein said wedge provides thermal conductivity between the circuit board and cooling plate
Data Source
AI summary
A cooling system for cooling circuit boards. The cooling system includes a casing, which includes at least two board slots and at least one cooling plate between the two board slots; at least one cover, which is placed on a circuit board to be secured to one of the board slots; and at least one wedge placed on the cover. The wedge provides thermal conductivity between the circuit board and the cooling plate when the circuit board is placed into the board slot; and at least one wedgelock that secures the circuit board to the board slot.