Cooling Plate Structure With Thinner Weld Channels for Laser Joining
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional cooling devices face inefficiencies in laser welding due to uniform board thickness, leading to prolonged welding times and increased energy consumption, which hinders improved welding efficiency and reduced costs.
Innovation Solution
The cooling device features boards with annular welding channels that are thinner at the welding locations, allowing for easier laser penetration and reduced energy consumption, along with a partitioning board and pump for enhanced fluid circulation and cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If uniform board thickness is used in conventional cooling devices, then structural simplicity is maintained, but laser welding time and energy consumption increase
Solution Approach 1:
The board is designed with non-uniform thickness, featuring a thinner welding portion at the welding location and a thicker remaining portion elsewhere. This local quality variation allows the laser to penetrate more easily at the welding area, reducing welding time and energy consumption, while the thicker remaining portion maintains structural integrity and cooling performance.
2Ease of manufacture
If uniform board thickness is used, then manufacturing simplicity is maintained, but welding convenience deteriorates
Solution Approach 1:
The welding portion is specifically designed with reduced thickness to facilitate laser penetration and improve welding convenience. The thinner welding portion allows for faster heat accumulation and weld pool formation, significantly reducing welding time compared to uniform thickness designs.
3Device complexity
If uniform board thickness is used, then structural simplicity is maintained, but welding energy consumption increases
Solution Approach 1:
The board structure incorporates a thickness variation where the welding portion is thinner than the remaining portion. This local quality change reduces the material that needs to be melted during laser welding, thereby decreasing laser welding energy consumption while maintaining overall structural integrity through the thicker remaining portion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design shortens welding times, reduces energy consumption, and improves both welding convenience and cooling efficiency, enabling better heat management for electronic devices.
Implementation Method 1
the thickness at the welding location is thinner than that of the remaining portion, so that a weld pool can be formed from the material more quickly when laser welding is performed
Implementation Method 2
The working fluid L proceeds with a gas-liquid phase change in the chamber 93 to transfer the heat of the heat source H outwards
Implementation Method 3
The two boards are coupled to each other by laser welding along the annular welding channel
Data Source
AI summary
A cooling device includes a partitioning board abutting inner faces of two boards, respectively. A chamber is defined between the partitioning board and one of the two boards. Another chamber is defined between the partitioning board and another of the two boards and intercommunicates with the chamber via an intercommunication port and a backflow port of the partitioning board. A pump drives a working fluid to circulate in the two chambers. Two welding channels are formed on outer faces of the two boards and surround the two chambers, respectively. The smallest distance between a channel bottom face of each annular welding channel and the inner face of a respective board having the annular welding channel is smaller than that between the inner and outer faces of the respective board. The two boards are coupled to the partitioning board along the annular welding channels by laser welding.