Cooling Projection Structure for Stronger Power Electronics Heat Dissipation
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Solution Overview
Problem
Existing cooling arrangements for power electronic components are limited in their cooling performance due to mechanical strength constraints on the size of cooling elevations, which restricts the surface area available for heat dissipation.
Innovation Solution
A method of manufacturing a cooling arrangement using a powder-metallurgical substance, where a green compact is formed, sintered into a preform, and then shaped into a cooling device with an enlarged-surface cooling structure featuring multiple cooling projections. This device is then bonded to a metal cast component using welding or soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If cooling elevations are made smaller in cross-section to increase surface area, then cooling performance is improved, but mechanical strength is reduced
Solution Approach 1:
The cooling device is divided into multiple independent cooling elevations (projections) that are segmented across the base section. Each elevation can be optimized for surface area while the collective arrangement maintains structural strength through distributed support points and optimized spacing.
Solution Approach 2:
The invention transitions from two-dimensional flat cooling surfaces to three-dimensional cooling elevations with optimized height-to-cross-section ratios. By utilizing the vertical dimension and creating projections with specific geometric profiles, the surface area is dramatically increased while the base section thickness and elevation root design maintain mechanical strength.
2Area of moving object
If complex cooling structures are manufactured using traditional methods, then cooling performance can be improved, but manufacturing complexity and cost increase
Solution Approach 1:
The invention changes the material state parameter from solid block to powder-metallurgical green compact, enabling complex three-dimensional cooling elevation structures to be formed through pressing and sintering processes. This parameter change allows near-net-shape manufacturing of complex geometries without traditional machining complexity.
Solution Approach 2:
The cooling device utilizes composite construction by bonding the powder-metallurgically manufactured base section with cooling elevations to a metal cast component. This composite approach allows each part to be optimized for its specific function (heat dissipation surface area vs. structural support and cooling fluid channels) while being manufactured through different optimal processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach enhances cooling performance by increasing the surface area for heat dissipation while maintaining mechanical strength, achieving efficient heat discharge from power electronic components and supporting serial production with cost-effectiveness and quality.
Implementation Method 1
sintering the green compact to a preform
Implementation Method 2
cooling projections, which cooling projections are formed by means of a pressure-loadable die by pressing a sub-section of the preform into form-defining recesses of the die
Implementation Method 3
around which a cooling fluid can flow
Implementation Method 4
jointing the cooling device by means of a material bond to a metal cast component by welding, in particular laser welding, or by soldering
Implementation Method 5
welding, in particular laser welding
Data Source
AI summary
A cooling arrangement and method of manufacturing a cooling arrangement for power electronic components are disclosed. The method includes provisioning a powder-metallurgical substance and forming or pressing the substance to a green compact; sintering the green compact to a preform; shaping the preform to a cooling device with an enlarged-surface cooling structure, the enlarged-surface cooling structure comprises a plurality of cooling projections, the cooling projections formed via a pressure-loadable die by pressing a sub-section of the preform into form-defining recesses of the die while a base section remains, the base section connects the individual cooling projections; and jointing the cooling device via a material bond to a metal cast component by welding or soldering.