Cooling Device Recess Coating for Precise Solder Attachment
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Solution Overview
Problem
In hybrid and electric vehicles, existing methods for attaching electrical and electronic assemblies to cooling devices face challenges in achieving precise positioning and preventing solder spread during the soft soldering process, which can lead to thermal resistance issues and corrosion.
Innovation Solution
A cooling device with a nickel coating featuring a recess on its top side allows for precise positioning and attachment of electrical and electronic assemblies using an intermediate solder layer, which is contained within the recess to prevent solder spread and enhance thermal conductivity, while also protecting against corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the cooling device is fully coated to protect against corrosion, then corrosion protection is improved, but positioning precision and solder containment deteriorate
Solution Approach 1:
The cooling device features a coating that is selectively applied only to specific regions (the recess area) rather than the entire surface. This local coating approach provides corrosion protection precisely where needed while leaving other areas uncoated for their intended functions, such as soldering and positioning.
Solution Approach 2:
The coating is segmented into distinct regions: a coated recess area for corrosion protection and an uncoated contact surface area for soldering and positioning. This segmentation allows different surface treatments to coexist on the same component, each optimized for its specific function.
2Reliability
If the contact surface is fully coated, then corrosion protection is improved, but thermal conductivity and soldering quality deteriorate
Solution Approach 1:
The coating is applied locally only to the recess area, creating a spatial differentiation where the coated region provides corrosion protection while the uncoated contact surface maintains optimal thermal conductivity and soldering properties.
3Ease of manufacture
If no coating is applied, then manufacturing simplicity is improved, but corrosion protection deteriorates
Solution Approach 1:
Rather than applying coating uniformly or not at all, the solution applies coating selectively to the recess area, providing corrosion protection in the most critical region while maintaining manufacturing efficiency.
4Area of stationary object
If the intermediate layer is allowed to spread freely, then coverage is improved, but positioning accuracy and solder containment deteriorate
Solution Approach 1:
The coated recess acts as an intermediary structure that contains the intermediate layer (solder). The coating creates physical boundaries that guide and confine the solder flow, ensuring it remains within the intended area while still providing adequate coverage for the electrical connection.
Solution Approach 2:
The coating is applied locally to the recess boundaries, creating a localized barrier that controls solder spread. This localized quality change in the coating distribution enables precise solder containment without affecting other areas of the contact surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures accurate positioning and effective heat dissipation with reduced thermal resistance and corrosion protection, improving the attachment process and thermal management in electrical and electronic devices.
Implementation Method 1
The coating prevents the soldering layer on the top side of the cooling device from spreading in a plane parallel to the top side of the cooling device beyond the recess in the coating
Implementation Method 2
the contact surface of the electrical and/or electronic assembly in the recess is in contact with the cooling device and is attached to the cooling device
Data Source
AI summary
For an electrical and/or electronic device, comprising at least one cooling device having a top side, an electrical and/or electronic assembly arranged on the top side of the cooling device having a contact surface, wherein the contact surface faces the top side of the cooling device and is attached to the top side of the cooling device by means of an intermediate layer arranged between the cooling device and the contact surface of the electrical and/or electronic assembly, it is proposed that a coating extending flat is arranged on the top side of the cooling device, wherein the coating on the top side of the cooling device comprises at least one recess, in which the top side of the cooling device is not coated, wherein the contact surface of the electrical and/or electronic assembly in the recess is in contact with the cooling device and attached to the cooling device.