Cooling Sheet Adhesive Layer Composition Seepage Control
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Solution Overview
Problem
Conventional cooling sheets with high water content in the adhesive layer face issues of seepage and spread unevenness, which are not adequately addressed by existing technologies.
Innovation Solution
The method involves mixing a composition containing water, alum, sodium edetate, polyacrylic acid, and neutralized polyacrylic acid to achieve specific content ratios and a mixing temperature of 5 to 23°C, resulting in an adhesive layer composition that suppresses seepage and spread unevenness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the water content in the adhesive layer is increased to enhance cooling performance, then cooling power and cooling duration are improved, but seepage of the adhesive layer occurs during storage and use
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive layer by incorporating specific ratios of water-soluble polymer (0.1-10% by mass), alum (0.01-1% by mass), and sodium edetate (0.01-0.5% by mass). This parameter optimization allows the adhesive layer to maintain high water content (60-98% by mass) while preventing seepage through controlled gel network formation and metal ion coordination.
Solution Approach 2:
The patent creates a composite adhesive layer system combining water-soluble polymer, alum, sodium edetate, and water. The water-soluble polymer forms a gel network that physically entraps water, while alum and sodium edetate create chemical crosslinks that further stabilize the structure. This composite approach enables high water content without seepage or spread unevenness.
2Reliability
If the water-soluble polymer content is increased to suppress seepage, then seepage is reduced, but spread unevenness occurs in the adhesive layer
Solution Approach 1:
The patent optimizes the water-soluble polymer content to a specific range (0.1-10% by mass relative to total adhesive layer mass) and combines it with alum (0.01-1% by mass) and sodium edetate (0.01-0.5% by mass). This balanced parameter setting provides sufficient viscosity for uniform spreading during application while maintaining seepage suppression during storage and use.
Solution Approach 2:
The patent introduces alum and sodium edetate as intermediary substances that mediate between the water-soluble polymer and water. These intermediaries form crosslinked gel structures that provide mechanical stability and prevent seepage without interfering with the uniform spreading of the adhesive layer during application.
3Quantity of substance
If conventional aqueous adhesive formulations are used with high water content, then cooling action is enhanced, but the adhesive layer becomes unstable and seeps through the backing layer
Solution Approach 1:
The patent develops a composite adhesive formulation containing water-soluble polymer, alum, sodium edetate, and water in specifically controlled ratios. The water-soluble polymer creates a gel matrix that stabilizes the high water content, while alum and sodium edetate form crosslinked structures that prevent the adhesive layer from becoming unstable or seeping through the backing layer during storage and use.
Solution Approach 2:
The patent changes the chemical composition parameters by incorporating alum (0.01-1% by mass) and sodium edetate (0.01-0.5% by mass) into the aqueous adhesive system. These parameter changes create a stable gel network that maintains structural integrity even at high water contents (60-98% by mass), preventing composition instability and seepage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the production of cooling sheets with high water content (up to 98.24% by mass) while effectively preventing seepage and spread unevenness, thereby enhancing cooling performance and durability.
Implementation Method 1
an alum and sodium edetate which form a complex with each other
Implementation Method 2
sodium edetate which forms a complex with aluminum ions
Implementation Method 3
a water-soluble polymer, water, and the like are blended in an adhesive layer
Implementation Method 4
a water-soluble polymer compound for the purpose of providing a water-containing patch having high water content
Data Source
AI summary
A method for producing an adhesive layer composition for producing a cooling sheet including a backing layer, an adhesive layer, and a liner layer, the method comprising the step of:mixing a composition to be mixed containing water, an alum, sodium edetate, a polyacrylic acid, and a neutralized polyacrylic acid such that a mixing temperature becomes 5 to 23° C., to obtain an adhesive layer composition, whereinin the composition to be mixed,a content of the water is 69 to 938.24% by mass relative to a total mass of the composition to be mixed,a content of the alum is 0.18 to 0.42% by mass relative to the total mass of the composition to be mixed,a content of the sodium edetate is 0.08 to 0.18% by mass relative to the total mass of the composition to be mixed, anda mass ratio between the content of the alum and the content of the sodium edetate (the content of the alum: the content of the sodium edetate) is 1:1 to 5.25:1.