Cooling Stage for Semiconductor Wafer Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor manufacturing apparatuses face limitations in wafer transfer speed and throughput due to high wafer temperatures post-film formation, requiring costly cooling solutions or increased footprint for cooling stages.
Innovation Solution
A wafer transfer apparatus with a mini environment and a cooling stage positioned near the load lock chamber, utilizing air flows from the mini environment to cool wafers, allowing for efficient transfer and buffering without the need for separate cooling systems, thus achieving low cost, small footprint, and high throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling stage is installed inside the mini environment, then wafer cooling is achieved, but the footprint increases
Solution Approach 1:
The cooling stage is merged with the load lock chamber structure, allowing the cooling function to be integrated into the existing apparatus footprint rather than requiring separate cooling infrastructure
Solution Approach 2:
A gate valve serves as an intermediary mechanism to selectively connect or isolate the cooling stage from the mini environment, enabling flexible thermal management without permanently modifying the mini environment structure
2Temperature
If separate cooling fans or cooling water are provided, then wafer cooling is promoted, but the cost increases
Solution Approach 1:
The cooling stage utilizes the existing vacuum pumping system to create negative pressure for cooling, eliminating the need for separate cooling fans or water systems and reducing overall apparatus cost
Solution Approach 2:
The vacuum pumping system performs dual functions: maintaining vacuum in the load lock chamber and providing cooling airflow when the cooling stage is activated, reducing the need for dedicated cooling equipment
3Temperature
If wafers are kept in the load lock chamber until cooling, then wafer temperature is controlled, but the transfer speed is limited and throughput is reduced
Solution Approach 1:
The cooling function is segmented from the load lock chamber operation, allowing wafer cooling to occur in parallel with other chamber operations rather than sequentially, thereby improving throughput
Solution Approach 2:
The cooling stage can be dynamically connected or disconnected from the mini environment via gate valve control, allowing flexible adaptation to different operational requirements and optimizing both cooling efficiency and throughput
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient cooling of wafers using ambient air, reducing cooling time and increasing transfer speed, thereby enhancing manufacturing throughput while maintaining process stability and minimizing costs.
Implementation Method 1
a cooling stage that opens and connects to the mini environment from the outside of the mini environment in the vicinity of (preferably above) a connection port thereof for the load lock chamber, in order to temporarily hold a wafer so that the wafer is cooled by the air taken in from the mini environment
Data Source
AI summary
A wafer transfer apparatus includes: (A) a mini environment that connects to a wafer storage part and a load lock chamber and is equipped with a transfer robot inside, in order to transfer wafers between the wafer storage part and load lock chamber in the presence of air flows; and (B) a cooling stage that opens and connects to the mini environment from the outside of the mini environment in the vicinity of the connection port of the load lock chamber, in order to temporarily hold a wafer so that the wafer is cooled by the air taken in from the mini environment.