Pad-Shaped Cooling Stand for Electronic Device Heat Dissipation
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Solution Overview
Problem
Current two-in-one computers face issues with high noise and high energy consumption due to air-cooled heat dissipation structures, which affect user experience.
Innovation Solution
An electronic device design that incorporates a pad-shaped cooling stand pivotally connected to the housing, using a flexible thermal pad to conduct heat generated by internal elements to a larger external area without fans, enhancing natural heat dissipation and allowing for a light and thin design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air-cooled heat dissipation structure is used, then heat dissipation performance is ensured, but noise and energy consumption increase
Solution Approach 1:
The patent extracts the fan component from the heat dissipation system and replaces it with a passive heat dissipation structure. The cooling stand extends outward from the housing to provide a large surface area for natural convection heat dissipation, eliminating the need for active fan-based cooling and its associated noise and energy consumption.
Solution Approach 2:
The patent transitions from internal heat dissipation to external heat dissipation by extending the cooling stand outward from the housing. This dimensional extension creates additional surface area in three-dimensional space, enabling more effective passive heat dissipation without increasing internal device complexity.
2Temperature
If fan is added for heat dissipation, then heat dissipation capability improves, but device complexity and weight increase
Solution Approach 1:
The patent removes the fan component entirely from the system and replaces it with a passive cooling structure. The cooling stand uses natural convection and radiation principles to dissipate heat without requiring any moving parts or active control mechanisms, thereby reducing device complexity.
3Temperature
If cooling components are added, then heat dissipation improves, but device weight and thickness increase
Solution Approach 1:
The cooling stand serves dual functions: it provides structural support for the device and simultaneously acts as a heat dissipation component. By integrating these two functions into a single component, the patent avoids adding separate cooling hardware that would increase weight and thickness.
Solution Approach 2:
The cooling stand is designed as a thin, flexible structure that can be easily integrated into the device housing. This thin-film approach allows effective heat dissipation surface area to be added without significantly increasing device thickness or weight.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation performance by enlarging the natural heat dissipation area, reducing noise, and lowering power consumption, while maintaining a compact form factor.
Implementation Method 1
heat generated by the heat emitting element is conducted to the pad-shaped cooling stand through the flexible thermal pad
Implementation Method 2
enlarging a natural heat dissipation area of the electronic device and improving heat dissipation performance
Implementation Method 3
enlarging a natural heat dissipation area of the electronic device and improving heat dissipation performance
Data Source
Figure 1~2
Figure 3~4
AI summary
An electronic device (100) is provided, including a housing (1) and a display (2), where the display (2) is disposed into the housing (1), so that the electronic device (100) becomes a structure having accommodation space inside. The electronic device (100) further includes: a heat emitting element (5), where the heat emitting element (5) is disposed in the accommodation space; a pad-shaped cooling stand (3), where the pad-shaped cooling stand is pivotally connected to the housing (1) through a rotating shaft and is at least capable of remaining in a first position in a folded state and a second position in a standing state; and a flexible thermal pad (6), where the flexible thermal pad (6) is flexible and bendable, a first end of the flexible thermal pad (6) extends into the accommodation space through a strip-shaped through hole disposed in the housing (1), a second end of the flexible thermal pad (6) is attached to the pad-shaped cooling stand (3), and heat generated by the heat emitting element (5) is conducted to the pad-shaped cooling stand (3) through the flexible thermal pad (6). The electronic device (100) enlarges a natural heat dissipation area to improve a heat dissipation capability and product performance of the electronic device.