Cooling Structure With Medium Flow Path for Compact Heat Dissipation
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Solution Overview
Problem
Conventional cooling structures for electronic components face challenges in enhancing cooling efficiency while maintaining miniaturization, high packing density, reduced weight, and thickness, especially with increasing heat generation in high-function, high-voltage applications like electric vehicles and robots.
Innovation Solution
A cooling structure incorporating a heat radiating part with a medium flow path, where a heat medium hole in the heat conduction plate allows natural convection to enhance heat dissipation, reducing the need for large heat sinks and increased cooling power.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat sink is enlarged or forced cooling power is increased to cope with increased heat generation, then cooling effect is improved, but device size and weight increase
Solution Approach 1:
The heat sink is divided into multiple heat radiating parts, each with its own medium flow path. This segmentation allows heat to be dissipated across multiple distributed locations rather than requiring a single large heat sink, thereby maintaining cooling effectiveness while reducing overall device size and weight.
Solution Approach 2:
A cooling medium (such as air or liquid) is introduced as an intermediary substance to carry heat away from the electronic component. The medium flows through the medium flow path, absorbing heat from the heat radiating parts and transporting it away, which enables efficient heat dissipation without requiring large thermal mass in the heat sink structure.
2Temperature
If the heat sink is enlarged or forced cooling power is increased to cope with increased heat generation, then cooling effect is improved, but device volume increases
Solution Approach 1:
The heat sink is divided into multiple heat radiating parts, each with its own medium flow path. This segmentation allows heat to be dissipated across multiple distributed locations rather than requiring a single large heat sink, thereby maintaining cooling effectiveness while reducing overall device size and weight.
Solution Approach 2:
The invention utilizes the third dimension by routing the medium flow path vertically through the heat radiating parts. This dimensional approach allows heat dissipation to occur in multiple spatial directions simultaneously, maximizing cooling efficiency within a compact volume and avoiding the need to expand the device footprint.
3Temperature
If conventional cooling structure is used, then manufacturing is simple, but cooling efficiency is insufficient for high heat generation
Solution Approach 1:
The heat sink is divided into multiple heat radiating parts, each with its own medium flow path. This segmentation allows heat to be dissipated across multiple distributed locations rather than requiring a single large heat sink, thereby maintaining cooling effectiveness while reducing overall device size and weight.
Solution Approach 2:
The cooling medium serves multiple functions simultaneously: it flows through the medium flow path to carry heat away, it can be forced or natural convection depending on design needs, and it enables the heat radiating parts to function independently. This multi-functionality achieves high cooling efficiency without proportionally increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively enhances cooling efficiency by utilizing natural convection to discharge heat through the medium flow path, allowing for miniaturization of the cooling structure while maintaining effective heat transfer, thus addressing the limitations of conventional cooling systems.
Implementation Method 1
through which a medium flows in the heat radiating part
Implementation Method 2
heat generated in an integrated circuit device mounted on a circuit board is transferred to a heat sink
Data Source
Figure 1
Figure 2(a)~2(d)
Figure 3
AI summary
To provide a cooling structural body which can enhance a cooling effect and can easily correspond to small-sizing and the like. The cooling structural body includes a heat radiating part having a mounting surface 2a on which an electronic component 101 is directly or indirectly mounted. A medium flow path through which a medium can flow is provided in the heat radiating part.