Electronic Component Cooling Support With Creepage Path Recesses
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Solution Overview
Problem
Existing solutions for electronic components face challenges in efficiently dissipating heat while maintaining adequate dielectric strength, as materials with high dielectric strength often have low thermal conductivity, and creepage currents can lead to unwanted electrical discharges or short-circuits, particularly in high-voltage applications.
Innovation Solution
The introduction of recesses and protruding elements on the support layer extends electrically possible pathways between the electronic component and the cooling body, increasing the surface area and effectively lengthening creep paths to prevent electrical discharges or short-circuits, using materials with high dielectric strength and thermal conductivity like aluminium oxide or aluminium nitride, and embedding these components in an insulating medium.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If materials with high dielectric strength are used for the support, then electrical insulation is improved, but thermal conductivity deteriorates
Solution Approach 1:
The support is made from a composite material that combines high dielectric strength with high thermal conductivity. Specifically, the patent uses sintered aluminum oxide or aluminum nitride, which are ceramic materials that simultaneously provide excellent electrical insulation (dielectric strength ≥10 kV/mm) and superior thermal conductivity (≥5 W/mK), thus resolving the contradiction between electrical insulation and heat dissipation.
2Ease of manufacture
If a flat support surface is used, then manufacturing is simplified, but creepage path length is reduced leading to electrical discharge risks
Solution Approach 1:
The support surface is transformed from a flat two-dimensional plane to a three-dimensional structured surface by adding protrusions and/or recesses. This dimensional change increases the creepage path length between the electronic component and cooling body while maintaining manufacturability through standard molding or machining processes, thus preventing surface electrical discharges.
Solution Approach 2:
The support features curved or rounded protrusions and recesses rather than sharp edges, which helps extend the creepage path while avoiding stress concentration points. The curved geometry provides both electrical insulation enhancement and manufacturing feasibility through conventional forming processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation and prevents electrical discharges by extending creep paths by at least 30%, ensuring reliable insulation and efficient cooling in high-voltage components, even when subjected to high operating voltages.
Implementation Method 1
a support physically interposed between the electronic component and the cooling body and which has at least one layer with at least one material of a dielectric strength of at least 10 kV/mm and a specific thermal conductivity of at least 5 W/mK
Implementation Method 2
the formation in the form of a recess and/or a protruding element extends or extend (lengthen) along the surface of the layer of the support preferably all electrically possible pathways between the electronic component and the cooling body
Data Source
AI summary
The invention relates to an arrangement comprising at least one electronic component and a cooling body associated therewith. A support physically interposed between the electronic component and the cooling body and the support has at least one layer with at least one material of an electric strength of at least 10 kV/mm and a thermal conductivity of at least 5 W/mK. At least one recess and/or at least one protruding element is arranged in and/or on the layer of the support, and is configured in such a manner that it extends, along the surface of the layer of the support, through preferably all electrically possible pathways between the electronic component and the cooling body as compared to the condition of the layer of the support without the recess and/or without the protruding element.