Cooling system with intermediate chamber
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Solution Overview
Problem
Conventional cooling systems for electronic components in HVAC&R systems face limitations in size, cooling capacity, and cost, and existing heat pipes are limited by friction and shear forces that reduce heat removal efficiency.
Innovation Solution
A cooling system with a fluid chamber and heat rejection system, utilizing an enclosure with evaporating and condensing surfaces to transfer thermal energy between a fluid and an electronic component, where the fluid transitions between liquid and vapor phases within the chamber, and heat is rejected via fins and external air convection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks with fins are used for convection cooling, then cooling efficiency is improved, but the size and cost increase
Solution Approach 1:
The patent utilizes phase change of the cooling fluid (evaporation and condensation) within the sealed enclosure to transfer heat. The fluid evaporates at the evaporating surface absorbing heat from electronics, then condenses at the condensing surface releasing heat to the heat rejection system. This phase transition mechanism enables efficient heat transfer in a compact volume without requiring large finned heat sinks.
2Temperature
If heat pipes with wick structures are used, then heat diffusion is improved, but friction and shear forces reduce cooling capacity
Solution Approach 1:
The patent removes the wick structure from the heat pipe system. Instead of relying on capillary action through a wick, the invention uses a sealed enclosure where phase change of the cooling fluid occurs directly. The fluid evaporates at the evaporating surface and condenses at the condensing surface without requiring a wick, thereby eliminating friction and shear forces that would otherwise reduce cooling capacity.
3Temperature
If metallic materials with high thermal conductivity are used, then heat transfer is improved, but the system complexity and cost increase
Solution Approach 1:
The patent introduces a cooling fluid as an intermediary medium within the sealed enclosure. Instead of relying solely on high-conductivity metallic materials, the fluid acts as a mediator that absorbs heat through evaporation at the evaporating surface and releases heat through condensation at the condensing surface. This approach simplifies material requirements while maintaining effective heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enhances cooling efficiency by utilizing both conduction and convection, improving heat removal from electronic components without the need for additional power sources and overcoming limitations of traditional systems.
Implementation Method 1
the evaporating surface is configured to transfer thermal energy from the electronic component to the liquid fluid, such that the liquid fluid transitions to a vapor fluid within the fluid chamber
Implementation Method 2
the condensing surface is configured to absorb thermal energy from the vapor fluid, such that the vapor fluid condenses into the liquid fluid within the fluid chamber
Implementation Method 3
the heat rejection system is configured to absorb thermal energy from the condensing surface
Data Source
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AI summary
The present disclosure relates to a cooling system of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system. The cooling system includes an enclosure defining a fluid chamber, and the enclosure includes an evaporating surface configured to be in thermal communication with a liquid fluid in the fluid chamber and with an electronic component coupled to the enclosure, where the evaporating surface is configured to transfer thermal energy from the electronic component to the liquid fluid, such that the liquid fluid transitions to a vapor fluid within the fluid chamber, and includes a condensing surface configured to absorb thermal energy from the vapor fluid, such that the vapor fluid condenses into the liquid fluid within the fluid chamber. The cooling system also includes a heat rejection system coupled to an exterior surface of the enclosure, where the heat rejection system is configured to absorb thermal energy from the condensing surface.