Cooling Telemetry Heatmaps for Dynamic Compute Liquid Cooling

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Solution Overview

Problem

Current liquid cooling systems for electronic components in data centers face challenges in dynamically managing cooling resources to meet varying thermal demands across different compute resources, especially in edge environments where workloads and ambient conditions change frequently, leading to inefficiencies in heat dissipation and resource allocation.

Innovation Solution

The implementation of a telemetry system that collects and analyzes data from sensors to dynamically adjust cooling parameters and workload allocations, using heatmaps to optimize cooling fluid distribution and reuse heat across the infrastructure, ensuring compliance with service-level agreements and improving resource utilization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If liquid cooling systems are used to cool electronic components, then cooling efficiency is improved, but system complexity increases

Engineering Contradiction:
Improvecooling efficiencyVSAvoidsystem complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The cooling system is divided into multiple independent cooling channels, each equipped with its own flow control valve and temperature sensors. This segmentation allows independent control of different cooling zones, improving cooling efficiency for high-heat components while keeping the overall system manageable through modular architecture.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system implements dynamic flow rate adjustment using electronically controlled valves that respond to real-time temperature data from sensors. This dynamic control optimizes cooling efficiency by adjusting flow rates based on actual thermal conditions, while the automation reduces manual intervention complexity.

Inventive Principle:
Principle #15Dynamics

2Reliability

If cooling parameters are dynamically adjusted to meet varying thermal demands, then thermal management effectiveness is improved, but control system complexity increases

Engineering Contradiction:
Improvethermal management effectivenessVSAvoidcontrol system complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Temperature sensors are strategically placed throughout the system to provide real-time feedback on thermal conditions. This feedback is fed into a control algorithm that automatically adjusts valve positions and pump speeds, improving thermal management effectiveness through continuous monitoring and adjustment while using standard control components to manage complexity.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The control system uses pre-programmed algorithms that automatically respond to temperature variations without requiring manual intervention. The system self-regulates by comparing sensor readings against target parameters and making appropriate adjustments, improving reliability while reducing the need for complex manual control interfaces.

Inventive Principle:
Principle #25Self-service

3Productivity

If telemetry systems are implemented to collect and analyze cooling data, then resource allocation efficiency is improved, but measurement and data processing complexity increases

Engineering Contradiction:
Improveresource allocation efficiencyVSAvoiddata processing complexity
Core Design Contradiction:
ProductivityVSDifficulty of detecting and measuring

Solution Approach 1:

The telemetry system uses multi-functional sensors that measure multiple parameters (temperature, flow rate, pressure) simultaneously, and a centralized control platform that handles data collection, analysis, and control decisions. This universal approach improves resource allocation efficiency by providing comprehensive system visibility while consolidating data processing functions to manage complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The system replaces manual monitoring and adjustment mechanisms with automated electronic sensors and control algorithms. Telemetry data is collected and processed electronically, enabling efficient resource allocation through automated decision-making while reducing the complexity associated with manual measurement and adjustment procedures.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables robust thermal management, optimizing cooling efficiency and resource allocation, reducing overheating risks, and promoting sustainable heating and cooling practices by dynamically adjusting cooling strategies based on real-time data analysis.

Implementation Method 1

The use of liquids to cool electronic components is being explored for its benefits over more traditional air cooling systems

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

liquid has inherent advantages of higher specific heat (when no boiling is involved) and higher latent heat of vaporization (when boiling is involved)

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

liquid has inherent advantages of higher specific heat (when no boiling is involved) and higher latent heat of vaporization (when boiling is involved)

Methodology Applied
Scientific EffectBoiling: Boiling

Implementation Method 4

liquid has inherent advantages of higher specific heat (when no boiling is involved) and higher latent heat of vaporization (when boiling is involved)

Methodology Applied
Scientific EffectLatent heat of vaporization: Latent Heat

Data Source

PatentUS20230273597A1Telemetry systems for monitoring cooling of compute components and related apparatus and methods
Publication Date: 2023.08.31 INTEL CORP
  • US20230273597A1 patent drawing
  • US20230273597A1 patent drawing
  • US20230273597A1 patent drawing

AI summary

Telemetry systems for monitoring cooling of compute components and related apparatus and methods are disclosed. An example apparatus includes interface circuitry, machine-readable instructions, and programmable circuitry to at least one of instantiate or execute the machine-readable instructions to generate a heatmap based on outputs of one or more sensors in an environment, the environment including a first compute device, the sensor outputs including a metric associated with a property of a coolant and a location of the sensor in the environment, identify a compute performance metric of the first compute device, determine a cooling parameter for the first compute device based on the heatmap and the compute performance metric, and cause a cooling distribution unit to control flow of the coolant in the environment based on the cooling parameter.