Cooling Transfer Module Layout for Higher-Capacity Substrate Treatment
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Solution Overview
Problem
Existing substrate treating devices have limited capacity for liquid treating chambers, which restricts production efficiency and requires either reduced process time or increased chamber numbers, making it difficult to perform tasks efficiently with only robotic assistance.
Innovation Solution
The apparatus and method for treating a substrate include a transfer part with multiple transfer robots and a cooling transfer module that allows for increased liquid treating units, simultaneous cooling and transfer of substrates, and reduced transfer steps, enhancing production efficiency and robotic accessibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of liquid treating chambers is increased to increase production capacity, then productivity is improved, but device complexity increases and robotic operation becomes more difficult
Solution Approach 1:
The patent combines the transfer function and cooling function into a single transfer chamber, allowing the substrate to be cooled during the transfer process. This merging eliminates the need for separate cooling chambers, thereby increasing the number of liquid treating chambers that can be accommodated in the apparatus while maintaining manageable complexity.
Solution Approach 2:
The transfer chamber is designed to serve multiple functions: transferring the substrate between processing modules and simultaneously cooling the substrate. This multi-functionality allows the same chamber to perform both transfer and thermal management roles, effectively increasing production capacity without proportionally increasing device complexity.
2Productivity
If the process time in liquid treating chamber is reduced to increase production, then productivity is improved, but manufacturing precision may deteriorate
Solution Approach 1:
The substrate is cooled in advance during the transfer process before entering the liquid treating chamber. This preliminary cooling action prepares the substrate for subsequent liquid treating processes, allowing for optimized process parameters and maintaining quality even with reduced process times.
Solution Approach 2:
The cooling process continues during the transfer operation without interrupting the workflow. By making the cooling action continuous and integrated into the transfer process, the system maintains manufacturing precision while improving overall productivity through uninterrupted operation.
3Adaptability or versatility
If multiple transfer steps are used to move substrate between modules, then flexibility is improved, but loss of time increases
Solution Approach 1:
The patent merges multiple transfer operations into a single integrated transfer chamber that can accommodate the substrate throughout the transfer process. This consolidation reduces the number of separate transfer steps and associated time losses while maintaining the flexibility needed for different processing configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution increases production efficiency by allowing more liquid treating units, reduces substrate transfer steps, and enables simultaneous cooling and transfer, improving the overall efficiency and accessibility of the substrate treatment process.
Implementation Method 1
a cooling transfer module to transfer the substrate between the first transfer robot and the second transfer robot and to cool the substrate
Implementation Method 2
a heat treating part disposed at an opposite side of the transfer part to face a first process treating part, and configured to perform heat-treatment with respect to the substrate
Data Source
AI summary
An apparatus for treating a substrate includes a transfer part, a first transfer robot and a second transfer robot disposed in a longitudinal direction of the transfer part, a liquid treating part disposed at one side of the transfer part to apply a liquid onto the substrate by supplying the liquid to the substrate, and a heat treating part disposed at an opposite side of the transfer part to face a first process treating part, to perform heat-treatment with respect to the substrate. The heat treating part includes a cooling transfer module to transfer the substrate between the first transfer robot and the second transfer robot and to cool the substrate.