Power Conversion Cooling Tubes with Integrated Flow Passages
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Solution Overview
Problem
The existing cooling structure for semiconductor elements in power conversion apparatuses, which uses grease between the semiconductor module and the cooling tube, suffers from high thermal resistance and reduced productivity due to the need for precise grease application and management, limiting further improvements in cooling performance.
Innovation Solution
A power conversion apparatus is designed with a semiconductor element, lead frames, a flow-passage formation body, an insulating portion, a metal joining material, and a resin sealing portion, where the insulating portion and flow-passage formation body are joined using the metal joining material, and the semiconductor element and lead frames are integrated with the flow-passage formation body using the resin sealing portion, reducing thermal resistance and enhancing cooling performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If grease is used between the cooling tube and semiconductor module, then thermal contact is achieved, but thermal resistance increases and manufacturing complexity increases due to precise grease application requirements
Solution Approach 1:
The patent extracts and eliminates the grease layer from the cooling structure. Instead of using grease between the cooling tube and semiconductor module, the invention directly contacts the cooling tube with the semiconductor module through a simplified structure, removing the intermediate grease layer that caused thermal resistance and manufacturing precision issues.
Solution Approach 2:
The patent introduces a new intermediary structure (the cooling tube with integrated flow passage and specific contact structure) that directly mediates between the semiconductor module and cooling system, replacing the grease intermediary. This new intermediary provides both thermal conduction and structural integration without requiring precise application procedures.
2Temperature
If grease is used for thermal contact, then cooling is achieved, but productivity decreases due to additional manufacturing steps and grease management
Solution Approach 1:
The patent removes the grease application step entirely from the manufacturing process. By designing a structure that achieves thermal contact without grease, the invention eliminates the time-consuming grease application and management steps, thereby improving manufacturing efficiency and productivity.
Solution Approach 2:
The patent merges the cooling tube structure with the flow passage formation body, integrating multiple functions into a single component. This integration eliminates the need for separate grease application steps and simplifies the assembly process, improving productivity while maintaining effective heat release.
3Temperature
If a cooling tube with grease is used, then thermal contact is achieved, but device complexity increases due to grease application and management requirements
Solution Approach 1:
The patent extracts and removes the grease component from the cooling structure, simplifying the overall device. By eliminating grease and its associated application and management requirements, the invention reduces device complexity while maintaining effective thermal contact through the integrated cooling tube design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves the cooling performance of semiconductor elements by reducing thermal resistance and simplifies the manufacturing process, thereby increasing productivity by relaxing thickness control and reducing the number of manufacturing steps.
Implementation Method 1
a metal joining material that joins the insulating portion and the flow-passage formation body
Implementation Method 2
a flow-passage formation body that forms a coolant flow passage in which a coolant flows
Data Source
AI summary
A power conversion apparatus includes a semiconductor element, a plurality of lead frames, a flow-passage formation body, an insulating portion, a metal joining material, and a resin sealing portion. The plurality of lead frames are electrically connected to the semiconductor element. The flow-passage formation body forms a coolant flow passage in which a coolant flows. The insulating portion is arranged between the lead frame and the flow-passage formation body to provide insulation between the lead frame and the flow-passage formation body. The metal joining material joins the insulating portion and the flow-passage formation body. The resin sealing portion seals the semiconductor element and the lead frames. The semiconductor element and the lead frames are integrated with the flow-passage formation body to form a semiconductor cooling assembly by the resin sealing portion.