Cooling Unit Conveyor Substrate Processing
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Solution Overview
Problem
Conventional substrate processing apparatuses for semiconductor and display devices have extended process times due to simultaneous loading and unloading processes, leading to increased manufacturing time and particle generation during heating and cooling cycles.
Innovation Solution
A cooling unit with a conveyor system that includes multiple cooling parts to efficiently cool substrates while transferring them, reducing process steps and particle generation, and an apparatus with a multi-stage heating and transfer system to streamline substrate handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If simultaneous loading and unloading is performed using a transfer part, then substrate handling capability is improved, but particle generation increases and process time extends
Solution Approach 1:
The substrate handling process is segmented into separate loading and unloading operations performed at different times. The heating unit and cooling unit operate independently without simultaneous transfer operations, eliminating particle generation while maintaining productivity through continuous processing cycles.
Solution Approach 2:
The substrate is pre-heated in the heating unit before transfer to the cooling unit. This preliminary heating action ensures the substrate reaches the required temperature before cooling begins, allowing for optimized process timing that prevents particle generation during transfer operations.
2Reliability
If conventional heating and cooling processes are used, then substrate treatment is completed, but process time is significantly extended
Solution Approach 1:
The heating and cooling units are merged into an integrated system where the substrate is continuously processed from heating to cooling without intermediate stopping or complex transfer operations. This merging of functions reduces process time while ensuring reliable substrate treatment through controlled thermal transitions.
Solution Approach 2:
The substrate undergoes continuous heating followed by continuous cooling in a seamless process flow. The conveyor system maintains continuous motion through the heating and cooling zones, eliminating idle time and significantly reducing the overall process time while maintaining treatment reliability.
3Temperature
If multi-stage cooling plates are used, then cooling efficiency is improved, but manufacturing cost increases
Solution Approach 1:
Instead of complex multi-stage cooling plates, the invention uses a hydraulic or pneumatic conveyor system that provides cooling through fluid circulation. This approach achieves effective cooling with simpler, more cost-manufacturable components while maintaining the required temperature control efficiency.
Solution Approach 2:
The cooling function is achieved through a simplified conveyor-based system that copies the essential cooling effect without replicating the complex multi-stage plate structure. This alternative implementation reduces manufacturing cost while maintaining adequate cooling efficiency for the substrate processing requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces substrate processing time, minimizes particle generation, and lowers manufacturing costs by using a cost-effective cooling conveyor instead of multi-stage cooling plates, achieving efficient heating and cooling processes.
Implementation Method 1
a first cooling part configured to cool the substrate while transferring the substrate on the conveyor and configured to provide a cooling atmosphere relative to the substrate over the conveyor
Data Source
AI summary
An apparatus for processing a substrate may include a heating plate configured to heat a substrate placed thereon, a cooling conveyor including a conveyor configured to transfer a heated substrate, and a first cooling part configured to cool the heated substrate while transferring the heated substrate on the conveyor and configured to provide a cooling atmosphere relative to the heated substrate over the conveyor, and a transfer part configured to transfer the heated substrate from the heating plate onto the conveyor.