Substrate Processing Cooling Valve Control for Temperature Uniformity

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Solution Overview

Problem

In semiconductor manufacturing, temperature control in substrate processing apparatuses with multiple zones experiences deviations during rapid cooling, leading to inconsistencies in temperature history and requiring manual optimization of PID parameters through trial and error, which is inefficient and dependent on operator experience.

Innovation Solution

A substrate processing apparatus with a reaction tube, a heater structure, a cooler, and a cooling controller that uses a prediction model to estimate temperatures and regulate the cooling valve's opening state to minimize errors between predicted and target temperatures, optimizing temperature control across zones.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If cooling gas flow rate is increased for rapid cooling, then cooling speed is improved, but temperature uniformity among zones deteriorates

Engineering Contradiction:
Improvecooling speedVSAvoidtemperature uniformity among zones
Core Design Contradiction:
SpeedVSStability of the object's composition

Solution Approach 1:

The cooling gas supply is divided into multiple independent zones, each with its own cooling valve. This allows separate control of cooling gas flow to different zones, enabling rapid cooling while maintaining temperature uniformity across all zones by adjusting each zone's cooling rate independently.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each zone is equipped with individually adjustable cooling valves that can be optimized for local cooling requirements. This local control capability allows the system to achieve both rapid overall cooling and uniform temperature distribution by tailoring cooling gas flow to specific zone needs.

Inventive Principle:
Principle #3Local quality

2Measurement precision

If PID parameters are optimized manually through trial and error, then temperature control precision can be improved, but time consumption and dependency on operator experience increase

Engineering Contradiction:
Improvetemperature control precisionVSAvoidparameter optimization time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The system automatically determines optimal PID parameters through self-diagnosis and self-adjustment mechanisms. The controller performs automatic parameter optimization without requiring manual trial-and-error adjustment by operators, thereby achieving precise temperature control while eliminating time consumption and dependency on operator experience.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The system uses feedback from temperature sensors and process data to automatically adjust PID parameters. By continuously monitoring temperature variations and cooling rates, the controller self-optimizes parameters to maintain precise temperature control across zones without manual intervention.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces inter-zone temperature deviations and improves temperature controllability by automatically adjusting cooling rates, reducing reliance on operator intuition and experience, and ensuring consistent temperature control during rapid cooling processes.

Implementation Method 1

a cooler including a cooling valve configured to supply a cooling medium to a space between the heater structure and the reaction tube

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

an exhaust fan configured to supply the cooling medium to the cooler

Methodology Applied
Scientific EffectForced convection: Forced Convection

Data Source

PatentUS20230257883A1Substrate processing apparatus, recording medium, and method of manufacturing semiconductor device
Publication Date: 2023.08.17 KOKUSAI DENKI KK
  • US20230257883A1 patent drawing
  • US20230257883A1 patent drawing
  • US20230257883A1 patent drawing

AI summary

There is provided a technique that includes: a reaction tube where a process chamber configured to process a substrate is formed; a heater structure including a heater heating the substrate; a cooler including a cooling valve supplying a cooling medium; an exhaust fan supplying the cooling medium to the cooler; and a cooling controller configured to: acquire a prediction model that includes information of the exhaust fan, final target temperature, and opening state of the cooling valve and estimates a predicted temperature predicting at least one selected from the group of a temperature of the heater and a temperature of the process chamber; acquire the at least one selected from the group of the temperature of the heater and the temperature of the process chamber, the opening state of the cooling valve, and the information of the exhaust fan; and regulate the opening state of the cooling valve.