Coordination Polymer Adhesive for Metal Substrates
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Solution Overview
Problem
Conventional adhesives used in electronic component materials, such as polymer-based adhesives and coordination polymer pastes, face issues with high coefficients of linear expansion, adhesion strength, and heat resistance when bonding metal adherends, leading to damage from temperature changes and insufficient adhesion.
Innovation Solution
A colloidal solution of a coordination polymer containing a transition metal and an azole is dispersed in a dispersion medium, forming an adhesive layer with low coefficients of linear expansion, high adhesion strength, and excellent heat resistance by crystallizing the polymer at specific temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If polymer-based adhesives are used, then adhesion strength is achieved, but coefficient of linear expansion is high causing damage to metal adherends due to temperature changes
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by using coordination polymers with specific metal ions (Co, Ni, Cu, Zn) and ligands (carboxylic acid, hydroxycarboxylic acid, or phenolic compounds) to achieve a coefficient of linear expansion matching metal substrates while maintaining adhesion strength
Solution Approach 2:
The patent creates a composite adhesive system combining coordination polymer molecules with specific metal ions and organic ligands to form a material that simultaneously provides metal-like thermal expansion properties and adhesive bonding capability
2Temperature
If coordination polymer paste is used, then heat resistance is improved, but adhesion strength is insufficient due to voids formed after solvent removal
Solution Approach 1:
The patent extracts and removes the solvent component from the coordination polymer paste formulation, using a solvent-free or low-solvent system that allows the coordination polymer to form a continuous adhesive matrix without creating voids, thereby maintaining both heat resistance and adhesion strength
Solution Approach 2:
The patent changes the physical state and compositional parameters of the coordination polymer from a paste formulation to a consolidated adhesive layer, eliminating the void formation issue while preserving the heat-resistant properties of the coordination polymer structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive layer exhibits high reliability against temperature changes and maintains strong adhesion and heat resistance, effectively bonding metal adherends with improved durability and stability.
Implementation Method 1
heating the adhesive layer to 100 to 300° C. to cure the adhesive layer
Data Source
AI summary
An adhesive comprises a colloidal solution in which a coordination polymer containing a transition metal such as zinc or cobalt and an azole such as at least one kind of imidazoles is dispersed in a dispersion medium such as an alcohol.