COP COC Microchip Bonding Adhesive
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Solution Overview
Problem
Cycloolefin polymer (COP) and cycloolefin copolymer (COC) substrates face challenges in bonding due to their inactive surfaces, leading to issues like crack generation and flow path blockage when using traditional adhesive agents, especially organic solvents, which also result in high fluorescence.
Innovation Solution
A bonded member comprising substrates formed of COP or COC, bonded using an adhesive layer made of paraffin or naphthene, optionally with adhesion auxiliary materials and macromonomers, which allows for effective bonding without solvent use, reducing fluorescence and preventing crack formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If traditional adhesive agents or organic solvents are used to bond COP/COC substrates, then bonding can be achieved, but cracks are generated in the substrate or bonded surface and flow paths collapse
Solution Approach 1:
The invention changes the chemical composition parameters of the adhesive agent by specifying it must be a two-component system comprising a copolymer of formula (1) and an isocyanate compound of formula (2), with specific molecular weight ranges and structural requirements. This parameter change ensures the adhesive bonds substrates without causing cracks or flow path collapse, resolving the contradiction between bonding strength and substrate integrity.
Solution Approach 2:
The invention uses a composite adhesive system combining two specific components: a copolymer with carboxyl groups and an isocyanate compound. This composite material approach creates an adhesive that is strong enough to bond COP/COC substrates while being gentle enough to prevent crack generation and maintain substrate integrity, including flow path structures.
2Strength
If organic solvents are used as adhesive agents, then substrates can be bonded, but the inside of the flow path is blocked by the organic solvent
Solution Approach 1:
The invention changes the solvent content parameter by specifying the adhesive agent must contain 5-50 mass% of a specific copolymer and 50-95 mass% of an isocyanate compound, creating a solvent-free or low-solvent system. This eliminates organic solvent blockage of flow paths while maintaining bonding capability through the reactive isocyanate groups that form strong covalent bonds with the substrate surfaces.
Solution Approach 2:
The invention extracts and eliminates harmful organic solvents from the adhesive agent composition, replacing them with a reactive two-component system. This extraction removes the source of flow path blockage while preserving and enhancing bonding strength through the chemical reactivity of the copolymer and isocyanate compound combination.
3Strength
If most adhesive agents are used to bond substrates, then bonding can be achieved, but fluorescence is high
Solution Approach 1:
The invention changes the chemical structure parameters of the adhesive by specifying a copolymer with specific repeating units (cycloolefin and other olefin components) and an isocyanate compound with particular structural features. These parameter changes result in an adhesive with low fluorescence characteristics while maintaining strong adhesion to COP/COC substrates, suitable for optical applications like DNA tests.
4Device complexity
If the surface of COP/COC substrates is left inactive, then the substrate structure is simple, but the substrates cannot be appropriately bonded by adhesive agent
Solution Approach 1:
The invention applies preliminary action by incorporating specific chemical groups (carboxyl groups in the copolymer and isocyanate groups in the second component) that are pre-positioned to react with the substrate surfaces. This preliminary chemical preparation enables strong bonding without requiring complex surface pretreatment processes, maintaining substrate structural simplicity while achieving appropriate bonding strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables strong and reliable bonding of COP or COC substrates with improved adhesion strength, suppressing crack generation and flow path blockage, while maintaining low fluorescence, thus enhancing the productivity and performance of microchip plates and other bonded members.
Implementation Method 1
an adhesive layer, through which the first substrate and the second substrate are bonded to each other
Implementation Method 2
the paraffin or the naphthene easily diffuses between (easily enters into) the polymer chains of the cycloolefin polymer (COP) or the cycloolefin copolymer (COC) and can activate (can easily move) a molecular chain of a polymer surface
Data Source
AI summary
A microchip plate made such that polymer substrates made, in particular, of a cycloolefin polymer (COP) or a cycloolefin copolymer (COC) can be appropriately bonded to each other and a process for producing the microchip plate are provided. A microchip plate (1) of an embodiment is constituted by a first substrate (2) and a second substrate (3), which are bonded to each other through an adhesive layer (5), wherein the first substrate (2) and the second substrate (3) are formed by a COP or a COC, and the adhesive layer (5) is formed of paraffin or naphthene or formed including paraffin or naphthene and at least any one of an adhesion auxiliary material, a polymer constituting each of the first substrate and the second substrate, and a macromonomer.