Component-on-Top Package Inductor Overhang for PCB Footprint Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional DC/DC regulators using discrete components on printed circuit boards suffer from noise, inefficiencies, and increased manufacturing complexity, leading to limited versatility, performance reliability, and large physical space consumption.
Innovation Solution
A component-on-top (CoP) package regulator device utilizing a system-in-package (SIP) with an inductor extending beyond its sides, allowing for a smaller footprint on the printed circuit board while enhancing efficiency and thermal performance by integrating regulator circuitry and inductor within a single package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If discrete components are used on a printed circuit board to provide voltage regulators, then the system can be assembled using standard components, but the physical board space consumption increases and manufacturing complexity increases
Solution Approach 1:
The patent combines multiple discrete components (regulator circuitry and inductor) into a single integrated CoP package. The regulator circuitry is mounted on a substrate within the package, and the inductor is positioned on top of the package, with internal connections establishing electrical coupling between them. This integration eliminates the need for separate discrete components on the PCB, reducing board space and simplifying manufacturing.
2Ease of manufacture
If discrete components are used on a printed circuit board to provide voltage regulators, then the system can be assembled using standard components, but the manufacturing costs increase
Solution Approach 1:
The CoP package integrates regulator circuitry and inductor into a single unit, reducing the total component count and assembly steps. This integration lowers manufacturing costs by eliminating multiple discrete component placements, soldering operations, and quality checks that would be required for separate components.
3Area of stationary object
If the inductor is fully contained within the SIP package, then the package is compact, but external component placement flexibility is reduced
Solution Approach 1:
The inductor extends beyond the lateral boundaries of the SIP package in the vertical dimension, creating an overhang structure. This allows the package footprint on the PCB to remain compact while providing external access points for the inductor terminals. The vertical extension enables external component placement flexibility without increasing the horizontal package area.
4Ease of manufacture
If traditional discrete component layouts are used, then component placement is simple, but thermal performance deteriorates
Solution Approach 1:
The CoP package integrates regulator circuitry and inductor in close proximity with direct internal connections, creating efficient thermal pathways. The compact integration allows heat to be dissipated more effectively from the regulator circuitry to the package structure and surrounding environment, improving thermal performance compared to dispersed discrete component layouts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The CoP package design reduces physical footprint, improves efficiency, and enhances thermal performance compared to traditional methods that increase switching frequency, thereby addressing the limitations of discrete component-based regulators.
Implementation Method 1
the inductor and the regulator circuitry of the SIP together implement a switching regulator
Implementation Method 2
the regulator circuitry includes a switching circuit for charging and discharging the inductor
Data Source
AI summary
This disclosure describes techniques to provide a regulator circuit using a component-on-top (CoP) package. The CoP package comprising a system-in-package (SIP) comprising regulator circuitry, the SIP having a top portion and a first side portion; and an inductor on the top portion of the SIP, wherein: the inductor is coupled to the regulator circuitry via the top portion of the SIP; and a first end of the inductor extends beyond the first side portion of the SIP.