Computer on Package Substrate for Wearable Computing
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Solution Overview
Problem
Wearable electronic and IoT devices lack the computing power of smartphones and other mobile devices, requiring reliance on larger devices for processing, which limits their convenience and usefulness due to the size constraints of conventional high-performance computing platforms.
Innovation Solution
The implementation of a computer on package construction, which eliminates the need for a motherboard by directly attaching core components to a substrate, excluding bulky I/O components and allowing for a high-performance, small form factor computing hub that can be integrated into wearable and IoT devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional motherboard construction is used to provide high computing power, then processing capabilities are improved, but device size increases making it unsuitable for wearable and IoT applications
Solution Approach 1:
The patent merges the CPU package, substrate, and core computing components into a single integrated 'computer on package' unit. This consolidation eliminates the need for a separate motherboard, reducing overall device volume while maintaining high computing power through direct integration of processing elements, memory, and I/O interfaces on a compact package substrate.
Solution Approach 2:
The patent implements a nested structure where the computer-on-package unit (containing CPU, memory, and core components) is integrated within a larger wearable or IoT device housing. This nested arrangement allows the high-performance computing core to be compactly housed within the constrained form factor of wearable devices, enabling portable applications without sacrificing processing capability.
2Power
If high-performance computing components are integrated into small devices, then processing capabilities are improved, but thermal management becomes more challenging
Solution Approach 1:
The patent introduces thermal interface materials and heat dissipation structures as intermediaries between the high-performance CPU package and the device housing. These intermediary thermal management components facilitate efficient heat transfer from the concentrated computing elements to the external environment, enabling thermal control in the compact computer-on-package architecture.
3Adaptability or versatility
If I/O components are included in the computing platform, then device functionality is improved, but size and complexity increase
Solution Approach 1:
The patent implements universal I/O interfaces on the computer-on-package substrate that can support multiple communication protocols and device types. This multi-functional approach allows a single standardized interface design to accommodate various wearable and IoT applications, reducing overall system complexity while maintaining high adaptability and versatility across different use cases.
Data Source
AI summary
Embodiments are generally directed to an apparatus utilizing computer on package construction. An embodiment of a computer includes a substrate; one or more semiconductor devices, the one or more semiconductor devices being direct chip attached to the substrate, the one or more semiconductor devices including a central processing unit (CPU); and one or more additional components installed on the substrate, wherein the computer excludes I/O components.