Copackaged Optical Connector Alignment Structure
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Solution Overview
Problem
The existing technology for aligning optical connectors with co-packaged optical systems is cumbersome and prone to damage, especially when dealing with numerous fibers and high-temperature solder reflow processes.
Innovation Solution
The proposed solution involves an alignment structure with a semi-confined open space that allows for precise alignment of miniature optical fiber array unit (FAU) connectors with photonic integrated circuit (PIC) chips, using a clamshell lid structure to secure the connectors in place.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional pigtailing and epoxy gluing methods are used to align fiber optic cables with optical connectors, then alignment can be achieved, but the structure becomes unwieldly and difficult to manage, especially when dealing with hundreds of fibers in co-packaged optical systems
Solution Approach 1:
The invention divides the fiber management system into modular units by introducing fiber management trays that organize multiple fibers into discrete, manageable sections. Each tray can independently hold and align multiple fiber optic cables, transforming a single complex alignment system into multiple manageable modules, thereby reducing overall structural complexity while maintaining alignment reliability
Solution Approach 2:
The invention introduces fiber management trays as intermediary structures between the fiber optic cables and the optical connectors. These trays serve as intermediate alignment platforms that simplify the direct alignment process by providing pre-organized fiber positions, reducing the complexity of managing hundreds of individual fiber alignments while ensuring stable and reliable connections
2Ease of manufacture
If ball-grid array (BGA) technology is used to attach CPO switch ICs to substrates, then electrical connections are achieved, but the high-temperature solder reflow process damages the fiber optics cable coatings
Solution Approach 1:
The invention implements preliminary thermal protection by covering fiber optic cables with heat-resistant materials or protective coatings before the BGA solder reflow process. This preliminary protective action allows the electrical attachment to proceed at high temperatures while preventing thermal damage to the fiber optic cable coatings, thus maintaining both manufacturing efficiency and fiber integrity
Solution Approach 2:
The invention applies thermal cushioning measures by introducing heat shields or insulating barriers between the BGA soldering area and the fiber optic cables. This beforehand cushioning creates a thermal buffer that absorbs or redirects heat away from the fiber coatings during the solder reflow process, enabling efficient electrical attachment without compromising fiber optic cable integrity
3Volume of moving object
If miniature optical connectors are used in co-packaged optical systems, then system miniaturization is achieved, but precise alignment becomes more difficult and requires novel support structures
Solution Approach 1:
The invention implements self-alignment mechanisms where the fiber management trays and connector mounts are designed with inherent alignment features such as precision-machined guide rails, keyed positions, or self-centering mechanisms. These self-service alignment features automatically position miniature optical connectors accurately without requiring complex external alignment equipment or procedures, thereby maintaining manufacturing precision while supporting system miniaturization
Solution Approach 2:
The invention changes the alignment parameter approach by transitioning from manual or active alignment methods to passive geometric constraint-based alignment. By designing fixed geometric relationships between connector mounts, fiber trays, and PCB locations, the system achieves precise alignment through dimensional control and rigid structural relationships rather than adjustable parameters, facilitating miniaturization while ensuring manufacturing precision
Data Source
AI summary
An apparatus for aligning a fiber array unit (FAU) connector with a photonic integrated circuit (PIC) includes an aligner having a front section and a bottom section respectively joined with two side sections spaced apart by a first distance. The front section and the bottom section are partially removed to expand a semi-confined open space between the two side sections for receiving a shelf extended out beyond a lens at a side edge of a PIC chip. The shelf has an alignment feature associated with the lens. The front section is configured as a support bar positioned on a surface of the PIC chip. The semi-confined open space between the two side sections allows a body of the FAU connector to be loaded down from top to sit on the shelf in the semi-confined open space and be aligned with the lens through the alignment feature.