Co-Packaged Optical Switch Tiles for Lower-Power Data Routing
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Solution Overview
Problem
Conventional methods for switching optical data are expensive and high-power-consuming due to the need for converting optical data to electrical data for routing, and they often fail to switch the underlying information data effectively.
Innovation Solution
The use of co-packaged optics (CPO) with multiple optical components that convert optical data to electrical data for switching and then back to optical data, along with a design that includes a digital-signal processor (DSP) die, photonic integrated circuit (PIC) die, and transimpedance amplifier (TIA) die, which allows for efficient and cost-effective data switching with reduced power consumption and board space requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional optical-to-electrical conversion methods are used for data switching, then data routing capability is improved, but power consumption and cost increase significantly
Solution Approach 1:
The patent combines multiple optical components (laser source, modulator, photodetector, TIA) and electronic components (DSP, driver) into a single co-packaged module. This integration reduces the number of separate optical-to-electrical conversion points, thereby reducing overall power consumption while maintaining full data routing capability across the optical switch fabric.
Solution Approach 2:
The patent replaces conventional electrical switching with optical switching using photonic integrated circuits. Optical signals are switched directly in the optical domain using optical modulators and photodetectors, eliminating the need for energy-intensive optical-to-electrical conversion at each switching point, thus reducing power consumption while maintaining routing versatility.
2Adaptability or versatility
If conventional optical-to-electrical conversion methods are used for data switching, then data routing capability is improved, but implementation cost increases
Solution Approach 1:
The patent integrates multiple discrete components (laser source, modulator, photodetector, TIA, DSP, driver) into a single co-packaged module. This consolidation reduces the number of separate components that need to be manufactured, tested, and assembled, thereby reducing implementation cost while maintaining full data routing capability.
Solution Approach 2:
The co-packaged optical module is designed as a universal building block that can be used in multiple configurations and applications. The module contains all necessary components for optical-to-electrical conversion, signal processing, and data routing, making it a multi-functional unit that reduces overall system complexity and cost.
3Use of energy by moving object
If co-packaged optics with multiple dies are used, then power consumption is reduced, but device complexity increases
Solution Approach 1:
The patent integrates multiple functional dies (PIC, DSP, driver, TIA) into a single co-packaged module with shared packaging infrastructure, including common substrate, unified thermal management, and integrated interconnects. This merging approach reduces device complexity by eliminating the need for separate packaging and interconnection of multiple independent components, while maintaining the power consumption benefits of integration.
4Area of stationary object
If co-packaged optics with multiple dies are used, then board space requirements are reduced, but device complexity increases
Solution Approach 1:
The patent combines multiple optical and electronic components into a single co-packaged module that occupies minimal board space. The integrated design includes shared packaging infrastructure, common substrate, and unified interconnects, reducing the overall footprint while managing the complexity of multiple dies through consolidated packaging and interconnection architectures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and cost-effective switching of 50 Tb/s of optical data with reduced power consumption and board space requirements, while maintaining excellent heat dissipation and RF performance, by using direct-detect or coherent optical components and short fiber jumpers for stress relief and fiber connection management.
Implementation Method 1
a PIC die, a DSP die, a driver die, and a TIA die
Implementation Method 2
a PIC die, a DSP die, a driver die, and a TIA die
Data Source
AI summary
An apparatus and system, including a switch; and a set of tiles; wherein each of the set of tiles include a PIC die, a DSP die, a driver die, and a TIA die and methods thereto.