Co-Packaged Optics Semiconductor Package for Low-Loss Data Links
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Solution Overview
Problem
Current electrical devices face limitations in achieving high data transmission speeds due to signal loss and inefficiencies in integrating photonic and electronic integrated circuit devices.
Innovation Solution
A semiconductor package design that incorporates a co-packaged optics (CPO) configuration, combining a photonic integrated circuit (PIC) device and an electronic integrated circuit (EIC) device, with optical fibers for signal transmission, and a connection substrate with through electrodes for electrical connectivity, enabling efficient signal processing and transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If photonic integrated circuit devices and electronic integrated circuit devices are separately packaged, then device reliability is maintained, but data transmission speed is limited and signal loss increases
Solution Approach 1:
The patent combines photonic integrated circuit devices and electronic integrated circuit devices into a single semiconductor package, placing both device types on the same substrate. This merging eliminates the need for separate packaging and interconnections, enabling direct optical-electrical signal conversion within the package. The combined structure reduces signal transmission distance and improves data transmission speed while minimizing signal loss.
Solution Approach 2:
The patent introduces an optical coupling structure as an intermediary between the photonic integrated circuit device and the electronic integrated circuit device. This intermediary enables efficient optical-to-electrical signal conversion and transmission within the package, facilitating high-speed data communication while reducing signal loss compared to traditional separate packaging approaches.
2Productivity
If photonic and electronic integrated circuit devices are integrated in a co-packaged optics configuration, then data transmission efficiency is enhanced, but device complexity increases
Solution Approach 1:
The patent segments the semiconductor package into distinct functional regions: a photonic integrated circuit device region, an electronic integrated circuit device region, and an optical coupling region. This segmentation allows each component to be optimized independently while maintaining overall integration benefits, managing device complexity through structured organization of functions.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support for both photonic and electronic devices, acts as an electrical interconnection layer, and facilitates thermal management. This multi-functionality reduces the need for additional separate components, enhancing data transmission efficiency while controlling device complexity.
3Speed
If optical fibers are directly attached to photonic integrated circuit devices, then signal transmission speed increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent implements preliminary alignment and fixation structures during the manufacturing process, including pre-positioned mounting holes, alignment marks, and fixed optical coupling structures. These preliminary actions ensure precise optical fiber attachment to the photonic integrated circuit device before final packaging, achieving high signal transmission speed while managing manufacturing precision requirements through advance preparation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves high-speed data signal processing at low power consumption by directly connecting PIC and EIC devices, reducing signal loss and enhancing data transmission efficiency.
Implementation Method 1
a photonic integrated circuit device to which an optical fiber is attached
Implementation Method 2
the electronic integrated circuit device is electrically connected to the package substrate via the plurality of mold through electrodes
Data Source
AI summary
Provided is a semiconductor package including a package substrate, a connection substrate mounted on the package substrate, and including a first conductive connection structure, a first integrated circuit device mounted on the package substrate, and a second integrated circuit device disposed on the connection substrate and the first integrated circuit device, and including a first portion overlapping the first integrated circuit device and a second portion overlapping the connection substrate, wherein one of the first integrated circuit device and the second integrated circuit device includes a photonic integrated circuit device to which an optical fiber is attached, and the other of the first integrated circuit device and the second integrated circuit device includes an electronic integrated circuit device, and wherein the second integrated circuit device is electrically connected to the package substrate via the first conductive connection structure of the connection substrate.